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Strain engineering has played a key role in modern silicon electronics, having been introduced as a mobility booster in the 1990s and commercialized in the early 2000s. Achieving similar advances with two-dimensional (2D) semiconductors in…
Intimate integration of memory devices with logic transistors is a frontier challenge in computer hardware. This integration is essential for augmenting computational power concurrently with enhanced energy efficiency in big-data…
As nanoelectronics approaches the nanometer scale, a massive effort is underway to identify the next scalable logic technology beyond Complementary Metal Oxide Semiconductor (CMOS) computing. Such computing technology needs to improve…
One of the biggest challenges in implementation of Quantum circuits or Photonic Integrated Circuits in general is the inability to create efficient relay devices due to small decoherence time, high delays and poor interconnections that…
Conventional stress monitoring relies on episodic, symptom-focused interventions, missing the need for continuous, accessible, and cost-efficient solutions. State-of-the-art approaches use rigid, silicon-based wearables, which, though…
Two-dimensional (2D) semimetals beyond graphene have been relatively unexplored in the atomically-thin limit. Here we introduce a facile growth mechanism for semimetallic WTe2 crystals, then fabricate few-layer test structures while…
Active metasurfaces promise reconfigurable optics with drastically improved compactness, ruggedness, manufacturability, and functionality compared to their traditional bulk counterparts. Optical phase change materials (O-PCMs) offer an…
We present FlexiTac, a low-cost, open-source, and scalable piezoresistive tactile sensing solution designed for robotic end-effectors. FlexiTac is a practical "plug-in" module consisting of (i) thin, flexible tactile sensor pads that…
Device passivation through ultraclean hexagonal BN encapsulation is proven one of the most effective ways for constructing high-quality devices with atomically thin semiconductors that preserves the ultraclean interface quality and…
Flexible hybrid electronics (FHE) is an emerging technology enabled through the integration of advanced semiconductor devices and 3D printing technology. It unlocks tremendous market potential by realizing low-cost flexible circuits and…
A micromorphic computational homogenization framework has recently been developed to deal with materials showing long-range correlated interactions, i.e. displaying patterning modes. Typical examples of such materials are elastomeric…
The escalating demands of compute-intensive applications urgently necessitate the adoption of optical interconnect technologies to overcome bottlenecks in scaling computing systems. This requires fully exploiting the inherent parallelism of…
Flexible electronics offer unique advantages for conformable, lightweight, and disposable healthcare wearables. However, their limited gate count, large feature sizes, and high static power consumption make on-body machine learning…
Printed electronics have gained significant traction in recent years, presenting a viable path to integrating computing into everyday items, from disposable products to low-cost healthcare. However, the adoption of computing in these…
Force and proximity sensors are key in robotics, especially when applied in collaborative robots that interact physically or cognitively with humans in real unstructured environments. However, most existing sensors for use in robotics are…
At the interface between two distinct materials desirable properties, such as superconductivity, can be greatly enhanced, or entirely new functionalities may emerge. Similar to in artificially engineered heterostructures, clean functional…
Although electrostatic microgenerators (ESMGs) have promised for nearly two decades extensive applications in wireless, self-powered microscale devices and sensors for security, personal health systems, communication, infrastructure and…
Recent progress in the synthesis and assembly of two-dimensional (2D) materials has laid the foundation for various applications of atomically thin layer films. These 2D materials possess rich and diverse properties such as layer-dependent…
In this study, we developed a UV-tape-assisted laser patterning (UT-Laser) technique that enables the simple transfer-based formation of wiring with line widths below 200 $\mu$m onto textile substrates. With the rapid advancement of…
We present a new optomechanical device where the motion of a micromechanical membrane couples to a microwave resonance of a three-dimensional superconducting cavity. With this architecture, we realize ultrastrong parametric coupling, where…