Junction between metal, superconductor and semiconductor materials seems to be promising for their applications as the electronic devices, microelectronic devices and high power transmission. E-mail [email protected].
@article{arxiv.cond-mat/0305397,
title = {Fabrication of Ag/Tl-Ba-Ca-CuO/CdSe nanostructure by electrodeposition technique},
author = {P. M. Shirage and D. D. Shivagan and L. A. Ekal and N. V. Desai and S. B. Mane and S. H. Pawar},
journal= {arXiv preprint arXiv:cond-mat/0305397},
year = {2015}
}