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Turbulent flows are fundamental in engineering and the environment, but their chaotic and three-dimensional (3-D) nature makes them computationally expensive to simulate. In this work, a dimensionality reduction technique is investigated to…
The growing demand for more efficient data transmission has made nanoscale high-throughput all-optical switching a critical requirement in modern telecommunication systems. Metasurface-based platforms offer unique advantages because of…
Three-dimensional integrated circuits promise power, performance, and footprint gains compared to their 2D counterparts, thanks to drastic reductions in the interconnects' length through their smaller form factor. We can leverage the…
The quest for energy-efficient, scalable neuromorphic computing has elevated compute-in-memory (CIM) architectures to the forefront of hardware innovation. While memristive memories have been extensively explored for synaptic implementation…
Two-dimensional (2D) superconductivity is a fascinating phenomenon packed with rich physics and wide technological application. The vortices and their dynamics arising from classical and quantum fluctuations give rise to…
Qubit mapping/routing is a critical stage in compilation for both near-term and fault-tolerant quantum computers, yet existing scalable methods typically impose several times the routing overhead in terms of circuit depth or duration. This…
Hybrid beamforming is a promising technology to improve the energy efficiency of massive MIMO systems. In particular, subarray hybrid beamforming can further decrease power consumption by reducing the number of phase-shifters. However,…
Trapped-ion Quantum Charge-Coupled Device (QCCD) architectures promise scalability through interconnected trap zones and dynamic ion transport; however, this transport capability creates a complex compilation challenge: how to move qubits…
Fast combinational multipliers with large bit widths can occupy significant silicon area, which also drives up power consumption. Area can be reduced through resource sharing (i.e., folding) at the expense of lower throughput, which is…
Emerging interconnects, such as CXL and NVLink, have been integrated into the intra-host topology to scale more accelerators and facilitate efficient communication between them, such as GPUs. To keep pace with the accelerator's growing…
While reduction in feature size makes computation cheaper in terms of latency, area, and power consumption, performance of emerging data-intensive applications is determined by data movement. These trends have introduced the concept of…
Spin qubits in silicon quantum dot arrays are a promising quantum computation platform for long-term scalability due to their small qubit footprint and compatibility with advanced semiconductor manufacturing. However, spin qubit devices…
Integrated micro-nanochannel networks in fluidic devices are desirable in a number of applications ranging from self-healing/cooling materials to bioengineering. The conventional micro-manufacturing techniques are capable of either…
The performance and scalability of two-dimensional (2D) field-effect transistors (FETs) are strongly influenced by geometry-defined electrostatics. In most 2D FET studies, the gate overlaps with the source and drain electrodes, allowing the…
Piecewise Linear Interface Construction (PLIC) is frequently used to geometrically reconstruct fluid interfaces in Computational Fluid Dynamics (CFD) modeling of two-phase flows. PLIC reconstructs interfaces from a scalar field that…
Holographic multiple-input multiple-output (MIMO) has emerged as a key enabler for 6G networks, yet conventional planar implementations suffer from spatial correlation and mutual coupling at sub-wavelength spacing, which fundamentally limit…
Reliability has become an increasing concern in modern computing. Integrated circuits (ICs) are the backbone of modern computing devices across industries, including artificial intelligence (AI), consumer electronics, healthcare,…
Durable interfacing of hard and soft materials is a major design challenge caused by the ensuing stress concentrations. In nature, soft-hard interfaces exhibit remarkable mechanical performance, with failures rarely happening at the…
A general model for treating the effects of three dimensional interface roughness (IFR) in layered semiconductor structures has been derived and experimentally verified. Configurational averaging of the IFR potential produces an effective…