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There are increasing number of works addressing the design challenges of fast, scalable solutions for the growing number of new type of applications. Recently, many of the solutions aimed at improving processing element capabilities to…
Advances in hybrid bonding and packaging have driven growing interest in 3D DRAM-stacked accelerators with higher memory bandwidth and capacity. As LLMs scale to hundreds of billions or trillions of parameters, distributed inference across…
The development of large-scale quantum systems increasingly relies on the close integration of heterogeneous components such as qubits, control electronics, and readout circuits, making thermal management at cryogenic temperatures a central…
Data with features of volume, velocity, variety, and veracity are challenging traditional tools to extract useful analysis for decision-making. By integrating high-dimensional analysis with visualization, this paper develops a 3D power-map…
This paper presents Omni 3D - a 3D-stacked device architecture that is naturally enabled by back-end-of-line (BEOL)-compatible transistors. Omni 3D arbitrarily interleaves metal layers for both signal/power with FETs in 3D (i.e., nFETs and…
Hybrid circuit quantum electrodynamics (cQED) aims at coupling various quantum degrees of freedom, among which are spin and charge degrees of freedom in gate defined quantum dots, phonons or magnons... with quantized electromagnetic fields…
As experimental quantum information processing (QIP) rapidly advances, an emerging challenge is to design a scalable architecture that combines various quantum elements into a complex device without compromising their performance. In…
Many efforts have been made in the past decade to realize topological superconductivity using superconducting proximity effect, but an ideal platform is still lacking. A 3D topological insulator (TI) is promising for this purpose due to the…
Silicon metal-oxide-semiconductor (MOS) spin qubits have become a promising platform for quantum information processing, with recent demonstrations of high-fidelity single and two-qubit gates. To move beyond a few qubits, however, more…
Beyond-diagonal reconfigurable intelligent surface (BD-RIS), which enables advanced wave control through interconnection of RIS elements, are gaining growing recognition as a promising technology for 6G and beyond. However, the enhanced…
Power splitters play a crucial role in virtually all photonic circuits, enabling precise control of on-chip signal distribution. However, state-of-the-art solutions typically present trade-offs in terms of loss, bandwidth, and fabrication…
Memories that exploit three-dimensional (3D)-stacking technology, which integrate memory and logic dies in a single stack, are becoming popular. These memories, such as Hybrid Memory Cube (HMC), utilize a network-on-chip (NoC) design for…
Recent experimental synthesis of two-dimensional (2D) heterostructures opens a door to new opportunities in tailoring the electronic properties for novel 2D devices. Here, we show that a wide range of lateral 2D heterostructures could have…
Today's systems are overwhelmingly designed to move data to computation. This design choice goes directly against at least three key trends in systems that cause performance, scalability and energy bottlenecks: (1) data access from memory…
In multilevel 3D integrated packaging, three major microstructures are viable due to the application of low volume of solders in different sizes, and/or processing conditions. Thermodynamics and kinetics of binary compounds in Cu/Sn/Cu low…
With aggressively shrinking process nodes, physical design methods face severe challenges due to poor convergence and uncertainty in getting an optimal solution. An early detection of potential failures is thus mandated. This has encouraged…
Quantum dot (QD) lay-outs are becoming more complex as the technology is being applied to more complex multi-QD structures. This increase in complexity requires improved capacitance modeling both for design and accurate interpretation of QD…
Superconducting circuits are among the leading contenders for quantum information processing. This promising avenue has been strengthened with the advent of circuit quantum electrodynamics, underlined by recent experiments coupling on-chip…
Multi-core neuromorphic systems typically use on-chip routers to transmit spikes among cores. These routers require significant memory resources and consume a large part of the overall system's energy budget. A promising alternative…
Dedicated hardware implementations of spiking neural networks that combine the advantages of mixed-signal neuromorphic circuits with those of emerging memory technologies have the potential of enabling ultra-low power pervasive sensory…