Related papers: Integrating MEMS and ICs
In the recent years, metasurfaces, being flat and lightweight, have been designed to replace bulky optical components with various functions. We demonstrate a monolithic Micro-Electro-Mechanical System (MEMS) integrated with a…
Recently the strong demands in wireless communication requires expanding development for the application of RF MEMS (Radio Frequency micro electro mechanical systems) sensing devices such as micro-switches, tunable capacitors because it…
In this paper we present the theoretical considerations and the design evolution of a proof-of-concept reconfigurable metasurface, primarily used as a tunable microwave absorber, but also as a wavefront manipulation and polarization…
Electrical impedance tomography with fully integrated microfluidics and electronics is presented for the first time in a CMOS chip. Chambers and electrodes are fabricated in the interconnect layers of a 65 nm CMOS chip through…
Functional aspects as well as the influence of integration technology on the system behavior have to be considered in the 3D integration design process of micro systems. Therefore, information from different physical domains has to be…
Enhancing performance while reducing costs is the fundamental design philosophy of integrated circuits (ICs). With advancements in packaging technology, interposer-based chiplet architecture has emerged as a promising solution. Chiplet…
The miniaturization and integration of electronic circuitry has not only made the enormous increase in performance of semiconductor devices possible but also spawned a myriad of new products and applications ranging from a cellular phone to…
Applications of inertial measurement units are extremely diverse, and are expected to see a further increase in number due to current trends in robotics as well as recent advances in Micro Electromechanical sensors (MEMS). The traditional…
An analog integrated circuit has been designed, in a BiCMOS 0.8 micron technology, for the feasability study of the signal processing of the AMS RICH photomultiplier tubes. This low power, three channel gated integrator includes its own…
Thermal behavior has become a first-order constraint in advanced 2.5D/3D integrated circuits (ICs) and heterogeneous packages. As power densities rise and multiple active dies are vertically integrated, heat removal paths become…
Integrated circuits are a cornerstone of modern information technology, and analog wave-based architectures could enable fast and efficient processing beyond conventional charge electronics. In magnonics, spin waves provide a highly…
We present design, fabrication and characterization of a MEMS VCSEL which utilizes a silicon-on-insulator wafer for the microelectromechanical system and encapsulates the MEMS by direct InP wafer bonding, which improves the protection and…
The vast majority of modern microelectronic devices rely on carriers within semiconductors due to their integrability. Therefore, the performance of these devices is limited due to natural semiconductor properties such as band gap and…
Nano-electro-opto-mechanical systems enable the synergistic coexistence of electrical, mechanical, and optical signals on a chip to realize new functions. Most of the technology platforms proposed for the fabrication of these systems so far…
The present study proposes the use of intelligent metasurfaces in the design of products, as enforcers of circular economy principles. Intelligent metasurfaces can tune their physical properties (electromagnetic, acoustic, mechanical) by…
Integrated sensing and communication (ISAC) emerges as a promising technology for B5G/6G, particularly in the millimeter-wave (mmWave) band. However, the widely utilized hybrid architecture in mmWave systems compromises multiplexing gain…
As photonic technologies continue to grow in multidimensional aspects, integrated photonics holds a unique position and continuously presents enormous possibilities to research communities. Applications span across data centers,…
Electromagnetic metasurfaces can be characterized as intelligent if they are able to perform multiple tunable functions, with the desired response being controlled by a computer influencing the individual electromagnetic properties of each…
s miniaturization of electrical and mechanical components used in modern technology progresses, there is an increasing need for high-throughput and low-cost micro-scale assembly techniques. Many current micro-assembly methods are serial in…
This tutorial review focuses on the basic theoretical backgrounds, their working principles, and implementation of impedance spectroscopy in both electroceramics and electrochemical research and technological applications. Various…