Recently the strong demands in wireless communication requires expanding development for the application of RF MEMS (Radio Frequency micro electro mechanical systems) sensing devices such as micro-switches, tunable capacitors because it offers lower power consumption, lower losses, higher linearity and higher Q factors compared with conventional communications components. To accelerate commercialisation of RF MEMS products, development for packaging technologies is one of the most critical issues should be solved beforehand.
@article{arxiv.0711.3297,
title = {Packaging of RF Mems Switching Functions on Alumina Substrate},
author = {M. -K. El Khatib and A. Pothier and P. Blondy},
journal= {arXiv preprint arXiv:0711.3297},
year = {2007}
}
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