This paper outlines the issues related to RF MEMS packaging and low actuation voltage. An original approach is presented concerning the modeling of capacitive contacts using multiphysics simulation and advanced characterization. A similar approach is used concerning packaging development where multi-physics simulations are used to optimize the process. A devoted package architecture is proposed featuring very low loss at microwave range.
Cite
@article{arxiv.0709.3022,
title = {BCB Based Packaging for Low Actuation Voltage RF MEMS Devices},
author = {David Peyrou and Fabienne Pennec and Hikmat Achkar and Patrick Pons and Fabio Coccetti and Hervé Aubert and Robert Plana},
journal= {arXiv preprint arXiv:0709.3022},
year = {2019}
}