Related papers: BCB Based Packaging for Low Actuation Voltage RF M…
Recently the strong demands in wireless communication requires expanding development for the application of RF MEMS (Radio Frequency micro electro mechanical systems) sensing devices such as micro-switches, tunable capacitors because it…
In RF-MEMS packaging, next to the protection of movable structures, optimization of package electrical performance plays a very important role. In this work, a wafer-level packaging process has been investigated and optimized in order to…
Low Temperature Cofired Ceramics (LTCC) has been a popular multi layer ceramic (MCM) packaging material for many electronic applications. The main advantage with LTCC would be its ability to embed a major part of the electronic circuit…
This paper concerns a new design of RF MEMS switch combined with an innovative process which enable low actuation voltage (<5V) and avoid stiction. First, the structure described with principal design issues, the corresponding anti-stiction…
Over the past few years, microelectromechanical system (MEMS) based on-chip resonators have shown significant potential for sensing and high frequency signal processing applications. This is due to their excellent features like small size,…
As optical telecommunication networks become more complex, there is an emerging need for systems capable of very complex switching and manipulation of large numbers of optical signals. MEMS enable these systems by combining excellent…
Cables made of MgB2 superconductors are currently explored as a viable solution for transporting high electrical power in the AC regime. In order to be competitive against the DC solution, the cables need to have an acceptable level of AC…
This work presents recent advances in the development and the integration of an electrochemical (chemicalelectrical energy conversion) micro power generator used as a high voltage energy source for RF-MEMS powering. Autonomous MEMS require…
Microelectromechanical systems (MEMS) resonators serve as frequency selective components in applications ranging from biology to communications. In this paper, the dynamic behavior of an RF MEMS disk resonator is formulated using an…
In RF (Radio Frequency) domain, one of the limitations of using MEMS (Micro Electromechanical Systems) switching devices for medium power applications is RF power. Failure phenomena appear even for 500 mW. A design of MEMS switched…
RF electronics deals with the generation, acquisition and manipulation of high-frequency signals. In particle accelerators signals of this kind are abundant, especially in the RF and beam diagnostics systems. In modern machines the…
Reconfigurable meta-surface (RMS) is proposed as a very promising and novel technology, which is composed of a large number of low-cost passive elements, and can achieve passive beamforming by controlling the amplitude and phase of incident…
In recent years, reduced basis methods (RBMs) have been adapted to the many-body eigenvalue problem and they have been used, largely in nuclear physics, as fast emulators able to bypass expensive direct computations while still providing…
In this work, we present a fully parameterized capped transmission line model for electromagnetic optimization of a wafer level package (WLP) for RF MEMS applications using the Ansoft HFSS-TM electromagnetic simulator. All the degrees of…
In this paper, we present a study on how to develop an efficient multiscale simulation strategy for the dynamics of chemically active systems on low-dimensional supports. Such reactions are encountered in a wide variety of situations,…
Two-dimensional materials (2DMs) are a promising alternative to complement and upgrade high-frequency electronics. However, in order to boost their adoption, the availability of numerical tools and physically-based models able to support…
In recent years, DC and AC microgrid (MG) systems have attracted a major attention due to various potential for integration of future technology into conventional systems and control. The integration of such technology requires appropriate…
Depending on the type of Micro-Electro-Mechanical System (MEMS), packaging costs are contributing up to 80% of the total device cost. Each MEMS device category, its function and operational environment will individually dictate the…
The majority of microelectromechanical system (MEMS) devices must be combined with integrated circuits (ICs) for operation in larger electronic systems. While MEMS transducers sense or control physical, optical or chemical quantities, ICs…
This paper studies scalable conjugate beamforming (CB) variants for physical-layer multicasting in cell-free massive multiple-input multiple-output (CF-mMIMO) systems. Focusing on fully distributed precoding, we analyze classical CB,…