Related papers: High Density Through Silicon Via (TSV)
4H-silicon carbide is a promising platform for solid-state quantum technology due to its commercial availability as a wide bandgap semiconductor and ability to host numerous spin-active color centers. Integrating color centers into…
Polydimethylsiloxane (PDMS) microfluidic devices have become a standard tool for engineering cells and multicellular networks in vitro. However, the reservoirs, or through-holes where cells access the devices, are usually fabricated…
Low-power quadrature voltage-controlled oscillator (QVCO) design utilizing transformer-feedback and current-reuse techniques with increased frequency range is proposed in this paper. With increasing demand for QVCOs in on-chip applications,…
Particle Image Velocimetry (PIV) typically relies on cross-correlation,which makes it difficult to obtain instantaneous velocity fields that are both spatially dense and available in real time at high acquisition rates. Optical Flow…
Materials improvements are a powerful approach to reducing loss and decoherence in superconducting qubits because such improvements can be readily translated to large scale processors. Recent work improved transmon coherence by utilizing…
State-of-the-art superconducting qubits rely on a limited set of thin-film materials. Expanding their materials palette can improve performance, extend operating regimes, and introduce new functionalities, but conventional thin-film…
Silicon strip sensors have long been a reliable technology for particle detection. Here, we push the limits of silicon tracking detectors by targeting an unprecedentedly low material budget of 2%-7% $X_0$ in an 8-layer 4 m$^2$ detector…
During recent years, microelectronics helped to develop complex and varied technologies. It appears that many of these technologies can be applied successfully to realize Seebeck micro generators: photolithography and deposition methods…
The performance of pixel modules built from 75 micrometer thin silicon sensors and ATLAS read-out chips employing the Solid Liquid InterDiffusion (SLID) interconnection technology is presented. This technology, developed by the Fraunhofer…
Porous silicon (PSi) layers has been prepared in this work via photoelectrochemical (PEC) etching process of an n type silicon wafers of two resistivities (3.5 ohm.cm and 0.02 ohm.cm) in hydrofluoric (HF) acid of 24.5 precent…
Light sheet fluorescence microscopy (LSFM) has transformed the way we visualize biological tissues in three dimensions, offering high-resolution imaging while minimizing photo-induced damage to the samples. Recent breakthroughs in…
The polarimetric self-coherent system using a direct-detection-based Stokes-vector receiver (SVR) is a promising technology to meet both the cost and capacity requirements of the short-reach optical interconnects. However, conventional SVRs…
We describe a novel approach for compressing truncated signed distance fields (TSDF) stored in 3D voxel grids, and their corresponding textures. To compress the TSDF, our method relies on a block-based neural network architecture trained…
Vanadium silicide (V$_3$Si) is a promising superconductor for integration with silicon-based electronics, however the interfacial growth kinetics have a strong influence on the resulting superconducting properties and are not yet fully…
Silicon Pore Optics (SPO) uses commercially available monocrystalline double-sided super-polished silicon wafers as a basis to produce mirrors that form lightweight high-resolution X-ray optics. The technology has been invented by cosine…
We demonstrate a sapphire machining process integrated with intermediate-scale quantum processors. The process allows through-substrate electrical connections, necessary for low-frequency mode-mitigation, as well as signal-routing, which…
This paper introduces an efficient and accurate pipeline for text-dependent speaker verification (TDSV), designed to address the need for high-performance biometric systems. The proposed system incorporates a Fast-Conformer-based ASR module…
Microwave plasma chemical vapor deposition (MPCVD) has been traditionally used to synthesize carbon-based materials such as diamonds, carbon nanotubes and graphene. Here we report that a rapid and catalyst-free growth of SnSe thin films can…
Total internal reflection fluorescence microscopy (TIRF) has enabled low-background, live-cell friendly imaging of cell surfaces and other thin samples thanks to the shallow penetration of the evanescent light field into the sample. The…
Silicon microelectronics, consisting of complementary metal oxide semiconductor (CMOS) technology, have changed nearly all aspects of human life from communication to transportation, entertainment, and healthcare. Despite the widespread and…