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This work proposes a 3D Stack In-Sensor-Computing (3DS-ISC) architecture for efficient event-based vision processing. A real-time normalization method using an exponential decay function is introduced to construct the time-surface, reducing…
Microfluidic mixing is a fundamental functionality in most lab on a chip (LOC) systems,whereas realization of efficient mixing is challenging in microfluidic channels due to the small Reynolds numbers. Here, we design and fabricate a…
Extrusion-based 3D printing of cementitious materials enables fabrication of complex structures, however it is highly sensitive to disturbances, material property variations, and process uncertainties that decrease flow stability and…
In the last years, high-resolution time tagging has emerged as the tool to tackle the problem of high-track density in the detectors of the next generation of experiments at particle colliders. Time resolutions below 50ps and event average…
A new readout technique was developed with the primary aim of keeping the number of channels in the front-end electronics as low as possible when scaling up the sensitive area of a Resistive Plate Chamber (RPC). The readout method here…
We propose single-step additive fabrication of graded-index optical elements by introducing the light exposure as the additional dimension to three-dimensional (3D) laser writing, hence (3+1)D writing. We use a commercial printer and…
An X-ray detector will be presented that is the combination of a segmented ionization chamber featuring one-dimensional spatial resolution integrated with an intelligent ADC front-end, multi DSP processing and embedded PC platform. This…
With the soaring demand for high-performing integrated circuits, 3D integrated circuits (ICs) have emerged as a promising alternative to traditional planar structures. Unlike existing 3D ICs that stack 2D layers, a full 3D IC features cubic…
Continuous scaling of CMOS has been the major catalyst in miniaturization of integrated circuits (ICs) and crucial for global socio-economic progress. However, scaling to sub-20nm technologies is proving to be challenging as MOSFETs are…
Three-dimensional (3D) technologies have been developing rapidly recent years, and have influenced industrial, medical, cultural, and many other fields. In this paper, we introduce an automatic 3D human head scanning-printing system, which…
Most previous 3D IC research focused on stacking traditional 2D silicon layers, so the interconnect reduction is limited to inter-block delays. In this paper, we propose techniques that enable efficient exploration of the 3D design space…
Transformers have emerged as the state-of-the-art architecture in medical image registration, outperforming convolutional neural networks (CNNs) by addressing their limited receptive fields and overcoming gradient instability in deeper…
Parallel and monolithic 3D integration directions offer pathways to realize 3D integrated circuits (ICs) but still lead to layer-by-layer implementations, each functional layer being composed in 2D first. This mindset causes challenging…
The demand for a large number of readout channels has been a limiting factor for the application of Micro-pattern Gaseous Detectors (MPGDs) in achieving higher spatial resolution and larger detection areas. This challenge is further…
3D die stacking and 2.5D interposer design are promising technologies to improve integration density, performance and cost. Current approaches face serious issues in dealing with emerging security challenges such as side channel attacks,…
Three-dimensional (3D)-stacking technology, which enables the integration of DRAM and logic dies, offers high bandwidth and low energy consumption. This technology also empowers new memory designs for executing tasks not traditionally…
2.5D integration is an important technique to tackle the growing cost of manufacturing chips in advanced technology nodes. This poses the challenge of providing high-performance inter-chiplet interconnects (ICIs). As the number of chiplets…
To overcome the well-known memory bottleneck of AI chips, 3D stacked architectures that employ advanced packaging technology with high-density through-silicon vias (TSVs) pins have proven to be a promising solution. The 3D-stacked AI chip…
This paper proposes and evaluates a novel architecture for a low-power Time-to-Digital Converter with high resolution, optimized for both integration in multichannel chips and high rate operation (40 Mconversion/s/channel). This converter…
We demonstrate single-shot compressive three-dimensional (3D) $(x, y, z)$ imaging based on interference coding. The depth dimension of the object is encoded into the interferometric spectra of the light field, resulting a $(x, y, \lambda)$…