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We explore the potential of 3D metal printing to realize complex conductive terahertz devices. Factors impacting performance such as printing resolution, surface roughness, oxidation, and material loss are investigated via analytical,…

With the widespread use of deep neural networks(DNNs) in intelligent systems, DNN accelerators with high performance and energy efficiency are greatly demanded. As one of the feasible processing-in-memory(PIM) architectures,…

Transformer-based models dominate modern AI workloads but exacerbate memory bottlenecks due to their quadratic attention complexity and ever-growing model sizes. Existing accelerators, such as Groq and Cerebras, mitigate off-chip traffic…

Nanoelectromechanical resonators have been successfully used for a variety of sensing applications. Their extreme resolution comes from their small size at the cost of low capture area, making the "needle in a haystack" issue acute. This…

The accelerating growth of global data generation demands data storage platforms that offer high capacity, long lifespan, and low energy consumption beyond the limits of electronic memory technologies. Optical storage provides an attractive…

The implementation of Hyperdimensional Computing (HDC) on In-Memory Computing (IMC) architectures faces significant challenges due to the mismatch between highdimensional vectors and IMC array sizes, leading to inefficient memory…

3D printing allows rapid fabrication of complex objects from digital designs. One 3D-printing process, direct laser writing, polymerises a light-sensitive material by steering a focused laser beam through the shape of the object to be…

Conventional 2D CMOS technology is reaching fundamental scaling limits, and interconnect bottleneck is dominating integrated circuit (IC) power and performance. While 3D IC technologies using Through Silicon Via or Monolithic Inter-layer…

Three-dimensional integrated circuits promise power, performance, and footprint gains compared to their 2D counterparts, thanks to drastic reductions in the interconnects' length through their smaller form factor. We can leverage the…

Modern integrated circuits are essentially two-dimensional (2D). Partial three-dimensional (3D) integration and 3D-transistor-level integrated circuits have long been anticipated as routes to improve the performance, cost and size of…

3D printing is considered the future of production systems and one of the physical elements of the Fourth Industrial Revolution. 3D printing will significantly impact the product lifecycle, considering cost, energy consumption, and carbon…

3D Gaussian Splatting (3DGS) has recently gained significant attention for high-quality and efficient view synthesis, making it widely adopted in fields such as AR/VR, robotics, and autonomous driving. Despite its impressive algorithmic…

Dynamic 3D Gaussian splatting (3DGS) extends static 3DGS to render dynamic scenes, enabling AR/VR applications with moving objects. However, implementing dynamic 3DGS on edge devices faces challenges: (1) Loading all Gaussian parameters…

Data-parallel applications, such as data analytics, machine learning, and scientific computing, are placing an ever-growing demand on floating-point operations per second on emerging systems. With increasing integration density, the quest…

In recent years, 3D convolutional neural networks have become the dominant approach for volumetric medical image segmentation. However, compared to their 2D counterparts, 3D networks introduce substantially more training parameters and…

Memories that exploit three-dimensional (3D)-stacking technology, which integrate memory and logic dies in a single stack, are becoming popular. These memories, such as Hybrid Memory Cube (HMC), utilize a network-on-chip (NoC) design for…

The everlasting demand for higher computing power for deep neural networks (DNNs) drives the development of parallel computing architectures. 3D integration, in which chips are integrated and connected vertically, can further increase…

The escalating demands of compute-intensive applications urgently necessitate the adoption of optical interconnect technologies to overcome bottlenecks in scaling computing systems. This requires fully exploiting the inherent parallelism of…

This paper proposes a ternary signalling scheme for inductive coupling links (ICLs) in 3D-integrated circuits (3D-ICs) to reduce crosstalk and electromagnetic interference in multi-stacked chip communications. By converting binary data into…

3D Gaussian Splatting (3DGS) has demonstrated remarkable effectiveness in 3D reconstruction, achieving high-quality results with real-time radiance field rendering. However, a key challenge is the substantial storage cost: reconstructing a…