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3D integration offers key advantages in improving system performance and efficiency for the End-of-Scaling era. It enables the incorporation of heterogeneous system components and disparate technologies, eliminates off-chip communication…
High-resolution lithographic techniques are often limited by low volumetric throughput, since there is no universal and scalable manufacturing process that can produce 3D metasurfaces. In this work, we demonstrate a high-speed holographic…
Detectors based on pixels with timing capabilities are gaining increasing importance in the last years. Next-to-come high-energy physics experiments at colliders require the use of time information in tracking, due to the expected levels of…
Plastic scintillator detectors with three-dimensional granularity and sub-nanosecond time resolution offer simultaneous particle tracking, identification, and calorimetry. However, scaling to larger volumes and finer segmentation poses…
Off-the-shelf fused filament fabrication 3D printers are widely accessible and convenient, yet they exhibit quality loss at high speeds due to dynamic mis-synchronization between printhead motion and material extrusion systems, notably…
Fast combinational multipliers with large bit widths can occupy significant silicon area, which also drives up power consumption. Area can be reduced through resource sharing (i.e., folding) at the expense of lower throughput, which is…
The task of 3D ICs layout design involves the assembly of millions of components taking into account many different requirements and constraints such as topological, wiring or manufacturability ones. It is a NP-hard problem that requires…
The emerging new paradigm of technologies, the internet of things, entails a process of device miniaturization to combine several functional components, such as sensors, actuators, and powering elements, in a single individual on-chip…
In embedded vision systems, parallel computation of the integral image presents several design challenges in terms of hardware resources, speed and power consumption. Although recursive equations significantly reduce the number of…
In this study, a method to construct a full-colour volumetric display is presented using a commercially available inkjet printer. Photoreactive luminescence materials are minutely and automatically printed as the volume elements, and…
The field of autonomous driving technology is rapidly advancing, with deep learning being a key component. Particularly in the field of sensing, 3D point cloud data collected by LiDAR is utilized to run deep neural network models for 3D…
3D intelligence leverages rich 3D features and stands as a promising frontier in AI, with 3D rendering fundamental to many downstream applications. 3D Gaussian Splatting (3DGS), an emerging high-quality 3D rendering method, requires…
For over 40 years lithographic silicon scaling has driven circuit integration and performance improvement in the semiconductor industry. As silicon scaling slows down, the industry is increasingly dependent on IC package technologies to…
We demonstrate the fabrication of volume holograms using 2-photon polymerization with dynamic control of light exposure. We refer to our method as (3+1)D printing. Volume holograms that are recorded by interfering reference and signal beams…
To improve transistor density and electronic performance, next-generation semiconductor devices are adopting three-dimensional architectures and feature sizes down to the few-nm regime, which require atomic-scale metrology to identify and…
Current multispectral imagers suffer from low photon efficiency and limited spectrum range. These limitations are partially due to the technological limitations from array sensors (CCD or CMOS), and also caused by separative measurement of…
Quantum computers are nearing the thousand qubit mark, with the current focus on scaling to improve computational performance. As quantum processors grow in complexity, new challenges arise such as the management of device variability and…
Spiking neural networks (SNNs) are powerful models of spatiotemporal computation and are well suited for deployment on resource-constrained edge devices and neuromorphic hardware due to their low power consumption. Leveraging attention…
Today, continued miniaturization in electronic integrated circuits (ICs) appears to have reached its fundamental limit. At the same time, energy consumption due by communication becomes the dominant limitation in high performance electronic…
Enhancing performance while reducing costs is the fundamental design philosophy of integrated circuits (ICs). With advancements in packaging technology, interposer-based chiplet architecture has emerged as a promising solution. Chiplet…