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A multiplier, as a key component in many different applications, is a time-consuming, energy-intensive computation block. Approximate computing is a practical design paradigm that attempts to improve hardware efficacy while keeping…
Modern computing workloads demand energy-efficient, high-bandwidth interconnects, motivating photonic interposers as an alternative to electrical links. Here we demonstrate a compact 3D silicon nitride (SiN) photonic interposer prototype…
Serving deep neural networks in latency critical interactive settings often requires GPU acceleration. However, the small batch sizes typical in online inference results in poor GPU utilization, a potential performance gap which GPU…
Programmable optical circuits form a key part of quantum technologies today, ranging from transceivers for quantum communication to integrated photonic chips for quantum information processing. As the size of such circuits is increased,…
Growing interest in semiconductor workforce development has generated demand for platforms capable of supporting large numbers of independent hardware designs for research and training without imposing high per-project overhead. Traditional…
Additive manufacturing is an expanding multidisciplinary field encompassing applications including medical devices, aerospace components, microfabrication strategies, and artificial organs. Among additive manufacturing approaches,…
A powerful fabrication strategy based on three-dimensional direct laser writing for the rapid prototyping of opto-mechanical components with critical features ranging from several hundred nm to a few mm is demonstrated here. As an example,…
It is natural to construct a multi-frame instead of a single-frame 3D detector for a continuous-time stream. Although increasing the number of frames might improve performance, previous multi-frame studies only used very limited frames to…
The 3D silicon sensor has demonstrated excellent performances (signal collection, detection efficiency, power consumption, etc.) comparable or even better with respect to the traditional planar sensor of the ATLAS Detector at the Large…
Recently three-dimensional (3D) imaging achieves tremendous success in consumer and industrial manufacturing. However, current 3D imaging methods rarely observe dynamical events happening in a short time interval due to the imaging speed…
Three-dimensional inspection of nanostructures such as integrated circuits is important for security and reliability assurance. Two scanning operations are required: ptychographic to recover the complex transmissivity of the specimen; and…
While photonic integrated circuits (PICs) are being widely used in applications such as telecommunications and datacenter interconnects, PICs capable of replacing bulk optics and fibers in high-precision, highly-coherent applications will…
Producing interactive 3D printed objects currently requires laborious 3D design and post-instrumentation with off-the-shelf electronics. Multi-material 3D printing using conductive PLA presents opportunities to mitigate these challenges. We…
The recent success of neural networks enables a better interpretation of 3D point clouds, but processing a large-scale 3D scene remains a challenging problem. Most current approaches divide a large-scale scene into small regions and combine…
At sub-20nm technologies CMOS scaling faces severe challenges primarily due to fundamental device scaling limitations, interconnection overhead and complex manufacturing. Migration to 3D has been long sought as a possible pathway to…
We introduce an ion trap platform based on a 3D-printed micro-junction array, designed to implement quantum charge-coupled device (QCCD) architectures for large-scale quantum information processing (QIP). The integration of…
Optical computing is considered a promising solution for the growing demand for parallel computing in various cutting-edge fields, requiring high integration and high speed computational capacity. In this paper, we propose a novel optical…
Hyperdimensional computing (HDC) is an emerging computing paradigm that represents, manipulates, and communicates data using very long random vectors (aka hypervectors). Among different hardware platforms capable of executing HDC…
Heterogeneous 3D System-on-Chips (3D SoCs) are the most promising design paradigm to combine sensing and computing within a single chip. A special characteristic of communication networks in heterogeneous 3D SoCs is the varying latency and…
3D Gaussian Splatting is a novel method for 3D view synthesis, which can gain an implicit neural learning rendering result than the traditional neural rendering technology but keep the more high-definition fast rendering speed. But it is…