Other Computer Science

Modelling MEMS involves a variety of software tools that deal with the analysis of complex geometrical structures and the assessment of various interactions among different energy domains and components. Moreover, the MEMS market is growing…

Due to the sensitivity of the piezoelectric layer in surface acoustic wave (SAW) resonators to temperature, a method of achieving device stability as a function of temperature is required. This work presents the design, modeling and…

This paper presents an implementation of the Cosserat theory into haptic sensing technologies for real-time simulation of microstructures. Cosserat theory is chosen instead of the classical theory of elasticity for a better representation…

This paper presents a detailed noise analysis and a noise-based optimization procedure for resonant MEMS structures. A design for high sensitivity of MEMS structures needs to take into account the noise shaping induced by damping phenomena…

In this paper we present the latest version of the TCAD environment BICEP'S (Braunschweigs Integrated CAD-Environment for Product Planning and Process Simulation). By using a central process database, which allows the exchange of all…

This paper deals with the design of MEMS using piezoresistivity as transduction principle. It is demonstrated that when the sensor topology doesn't allow a perfect matching of strain gauges, the resolution is limited by the ability of the…

The Through Silicon Via (TSV) process developed by Silex provides down to 30 micrometers pitch for through wafer connections in up to 600 micrometers thick substrates. Integrated with MEMS designs it enables significantly reduced die size…

This paper presents the study of an original closed-loop conditioning approach for fully-integrated convective inertial sensors. The method is applied to an accelerometer manufactured on a standard CMOS technology using an auto-aligned bulk…

Emerging 3D chips stacking and MEMS/Sensors packaging technologies are using DRIE (Deep Reactive Ion Etching) to etch through-silicon via (TSV) for advanced interconnections. The interconnection step can be done prior to or post CMOS…

This special session on 3D TSV's will highlight some of the fabrication processes and used technologies to create vias from the frontside of an active circuit to its backside and potential implementation solutions to form complex systems…

3D-Integration is a promising technology towards higher interconnect densities and shorter wiring lengths between multiple chip stacks, thus achieving a very high performance level combined with low power consumption. This technology also…

Two dimensional (2D) integration has been the traditional approach for IC integration. Due to increasing demands for providing electronic devices with superior performance and functionality in more efficient and compact packages, has driven…

This study investigates a high Q-factor spiral inductor fabricated by the CMOS (complementary metal oxide semiconductor) process and a post-process. The spiral inductor is manufactured on silicon substrate using the 0.35 micrometers CMOS…

A new technique was developed for studying the mechanical behavior of nano-scale thin metal films on substrate is presented. The test structure was designed on a novel "paddle" cantilever beam specimens with dimensions as few hundred…

The purpose of this paper is to apply characteristics of residual stress that causes cantilever beams to bend for manufacturing a micro-structured gas flow sensor. This study uses a silicon wafer deposited silicon nitride layers,…

For a set of operating conditions and coating color formulations, undesirable phenomena like color spitting and coating ribs may be triggered in the Micro-nip during the coating process. Therefore, our interest in this work focus on another…

MEMS technology has been developed rapidly in the last few years. More and more special micro structures were discussed in several publications. However, all of the structures were produced by consist of the three fundamental structures,…

In order to develop a new structure microwave probe, the fabrication of AFM probe on the GaAs wafer was studied. A waveguide was introduced by evaporating Au film on the top and bottom surfaces of the GaAs AFM probe. A tip having 8…

This paper reports on formation of high aspect micro patterns on low temperature co-fired ceramic (LTCC) substrates by integrating micro inkjetting with electroless plating. Micro inkjetting was realized by using an inkjetting printer that…

A new symmetrical four-wire sensor configuration has resulted in a fully integrated sound intensity sensor with significant lower noise floor and smaller size than its predecessors. An integrated sound pressure sensor was further…