Atomic layer deposition on particulate materials from 1988 through 2023: A quantitative review of technologies, materials and applications
Abstract
Atomic layer deposition (ALD) is widely studied for numerous applications and is commercially employed in the semiconductor industry, where planar substrates are the norm. However, the inherent ALD feature of coating virtually any surface geometry with atomistic thickness control is equally attractive for coating particulate materials (supports). In this review, we provide a comprehensive overview of the developments in this decades-old field of ALD on particulate materials, drawing on a bottom-up and quantitative analysis of 799 articles from this field. The obtained dataset is the basis for abstractions regarding reactor types (specifically for particles), coating materials, reactants, supports and processing conditions. Furthermore, the dataset enables direct access to specific processing conditions (for a given material, surface functionality, application etc.) and increases accessibility of the respective literature. We also review fundamental concepts of ALD on particles, and discuss the most common applications, i.e., catalysis (thermo-, electro-, photo-), batteries, luminescent phosphors and healthcare. Finally, we identify historical trends, and provide an outlook on prospective developments.
Keywords
Cite
@article{arxiv.2506.17725,
title = {Atomic layer deposition on particulate materials from 1988 through 2023: A quantitative review of technologies, materials and applications},
author = {Peter M. Piechulla and Mingliang Chen and Aristeidis Goulas and Riikka L. Puurunen and J. Ruud van Ommen},
journal= {arXiv preprint arXiv:2506.17725},
year = {2025}
}
Comments
Supporting Information starting on page 241 of the PDF; to be published in ACS Chemistry of Materials