相关论文: Cooling Channel Design Optimization for High Power…
Rapid growth in artificial intelligence (AI) workloads is driving up data center power densities, increasing the need for advanced thermal management. Direct-to-chip liquid cooling can remove heat efficiently at the source, but many cold…
A framework for topology optimization of cooling channels is proposed, which paves the way towards automated design of additively-manufactured cooling channels, required in applications such as the efficient heat management of die casting…
The continuous increase in computational power of GPUs, essential for advancements in areas like artificial intelligence and data processing, is driving the adoption of liquid cooling in data centers. Skived copper cold plates featuring…
Efficient thermal management in high-power electronic devices requires cooling channel designs that provide high heat removal while satisfying strict spatial and manufacturing constraints. This study presents a two-stage hierarchical…
Cooling high-power electronics in multilayer integrated circuits (ICs) is challenging for existing cooling methods. In this work, we designed through-chip microchannels (TCMCs) that cross the entire chip perpendicularly to the layers, with…
Design of effective micro cooling systems to address the challenges of ever increasing heat flux from microdevices requires deep examination of real time problems and has been tackled in depth. The most common and apparently misleading…
As modern electronic devices are increasingly miniaturized and integrated, their performance relies more heavily on effective thermal management. Two-phase cooling methods enhanced by porous surfaces, which capitalize on thin-film…
We model a microchannel cooling system and consider the optimization of its shape by means of shape calculus. A three-dimensional model covering all relevant physical effects and three reduced models are introduced. The latter are derived…
Thermal energy storage using sensible heating of a solid storage medium is a potential low-cost technology for long-duration energy storage. To effectively get heat in and out of the solid material, channels of heat transfer fluid can be…
Thermal energy storage (TES) systems coupled with heat pumps offer significant potential for improving building energy efficiency by shifting electricity demand to off-peak hours. However, conventional operating strategies maintain…
Hot-spots are considered among the unavoidable consequences of the high integration density of 3D-ICs. Eliminating hot spots requires employing efficient cooling techniques. Using embedded channels, liquid cooling systems can be designed to…
Multimodal deep learning models enable joint learning across heterogeneous data sources, including text, images, and video, but their rapid scaling introduces significant memory and communication bottlenecks. As model sizes and sequence…
The race towards performance increase and computing power has led to chips with heterogeneous and complex designs, integrating an ever-growing number of cores on the same monolithic chip or chiplet silicon die. Higher integration density,…
Microchannel heat sinks are an efficient cooling method for semiconductor packages. However, to properly cool increasingly complex and thermally dense circuits, microchannel designs should be improved and expanded on. In this paper,…
Heterogeneous processors with architecturally different cores (CPU and GPU) integrated on the same die lead to new challenges and opportunities for thermal and power management techniques because of shared thermal/power budgets between…
High power density systems require efficient cooling to maintain their thermal performance. Despite this, as systems get larger and more complex, human practice and insight may not suffice to determine the desired thermal management system…
High temperatures have dramatic negative effects on interconnect performance and, hence, numerous techniques have been proposed to reduce the power consumption of on-chip buses. However, existing methods fall short of fully addressing the…
We consider the problem of finding the energy minimum of a complex quantum Hamiltonian by employing a non-Markovian bath prepared in a low energy state. The energy minimization problem is thus turned into a thermodynamic cooling protocol in…
Sympathetic cooling is a technique often employed to mitigate motional heating in trapped-ion quantum computers. However, choosing system parameters such as number of coolants and cooling duty cycle for optimal gate performance requires…
Controlling thermodynamic cycles to minimize the dissipated heat is a longstanding goal in thermodynamics, and more recently, a central challenge in stochastic thermodynamics for nanoscale systems. Here, we introduce a theoretical and…