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Rising demand in AI and automotive applications is accelerating 2.5D IC adoption, with multiple chiplets tightly placed to enable high-speed interconnects and heterogeneous integration. As chiplet counts grow, traditional placement tools,…

数值分析 · 数学 2025-11-24 Qipan Wang , Tianxiang Zhu , Tianyu Jia , Yibo Lin , Runsheng Wang , Ru Huang

Chiplet-based architectures and advanced packaging has emerged as transformative approaches in semiconductor design. While conventional physical design for 2.5D heterogeneous systems typically prioritizes wirelength reduction through tight…

Chiplets are modular integrated circuits that can be combined to form a larger system, offering flexibility and performance enhancements. However, their dense packing often leads to significant thermal management challenges, requiring…

计算物理 · 物理学 2025-02-25 Giuseppe Romano , Aakrati Jain , Nima Dehmamy , Cheng Chi , Xin Zhang

Chiplet-based systems, integrating various silicon dies manufactured at different integrated circuit technology nodes on a carrier interposer, have garnered significant attention in recent years due to their cost-effectiveness and…

机器学习 · 计算机科学 2024-04-09 Zhihui Deng , Yuanyuan Duan , Leilai Shao , Xiaolei Zhu

Timing optimization during global placement is critical for achieving optimal circuit performance and remains a key challenge in modern Field Programmable Gate Array (FPGA) design. As FPGA designs scale and heterogeneous resources increase,…

硬件体系结构 · 计算机科学 2025-12-02 He Jiang , Yi Guo , Shikai Guo , Huijiang Liu , Xiaochen Li , Ning Wang , Zhixiong Di

Chiplet-based systems have gained significant attention in recent years due to their low cost and competitive performance. As the complexity and compactness of a chiplet-based system increase, careful consideration must be given to…

机器学习 · 计算机科学 2024-01-17 Yuanyuan Duan , Xingchen Liu , Zhiping Yu , Hanming Wu , Leilai Shao , Xiaolei Zhu

Multi-agent navigation in dynamic environments is of great industrial value when deploying a large scale fleet of robot to real-world applications. This paper proposes a decentralized partially observable multi-agent path planning with…

机器人学 · 计算机科学 2020-08-03 Zuxin Liu , Baiming Chen , Hongyi Zhou , Guru Koushik , Martial Hebert , Ding Zhao

3D stacked technology has emerged as an effective mechanism to overcome physical limits and communication delays found in 2D integration. However, 3D technology also presents several drawbacks that prevent its smooth application. Two of the…

硬件体系结构 · 计算机科学 2024-02-23 David Cuesta , José L. Risco-Martín , José L. Ayala , J. Ignacio Hidalgo

Close and precise placement of irregularly shaped objects requires a skilled robotic system. The manipulation of objects that have sensitive top surfaces and a fixed set of neighbors is particularly challenging. To avoid damaging the…

机器人学 · 计算机科学 2024-10-14 Benedikt Kreis , Nils Dengler , Jorge de Heuvel , Rohit Menon , Hamsa Perur , Maren Bennewitz

Multi-Agent Path Finding (MAPF) poses a significant and challenging problem critical for applications in robotics and logistics, particularly due to its combinatorial complexity and the partial observability inherent in realistic…

多智能体系统 · 计算机科学 2025-09-29 Merve Atasever , Matthew Hong , Mihir Nitin Kulkarni , Qingpei Li , Jyotirmoy V. Deshmukh

Multi-agent target assignment and path planning (TAPF) are two key problems in intelligent warehouse. However, most literature only addresses one of these two problems separately. In this study, we propose a method to simultaneously solve…

人工智能 · 计算机科学 2024-10-29 Qi Liu , Jianqi Gao , Dongjie Zhu , Zhongjian Qiao , Pengbin Chen , Jingxiang Guo , Yanjie Li

Rapidly evolving artificial intelligence and machine learning applications require ever-increasing computational capabilities, while monolithic 2D design technologies approach their limits. Heterogeneous integration of smaller chiplets…

Transformer has emerged as a powerful deep-learning technique for two-dimensional (2D) seismic data interpolation, owing to its global modeling ability. However, its core operation introduces heavy computational burden due to the quadratic…

地球物理 · 物理学 2026-01-22 Changxin Wei , Xintong Dong , Xinyang Wang

The emergence of truck-drone collaborative systems in last-mile logistics has positioned the Traveling Salesman Problem with Drones (TSP-D) as a pivotal extension of classical routing optimization, where synchronized vehicle coordination…

机器学习 · 计算机科学 2025-11-10 Taihelong Zeng , Yun Lin , Yuhe Shi , Yan Li , Zhiqing Wei , Xuanru Ji

Chip placement, a critical step in the VLSI physical design flow, directly impacts performance, power, and routability. Traditional chip placement methods, relying on analytical optimization or sequential reinforcement learning (RL), face…

硬件体系结构 · 计算机科学 2026-04-08 Kien Le Trung , Truong-Son Hy

This paper addresses the cooperative Multi-Vehicle Dynamic Pickup and Delivery Problem with Stochastic Requests (MVDPDPSR) and proposes an end-to-end centralized decision-making framework based on sequence-to-sequence, named Multi-Agent…

机器学习 · 计算机科学 2025-12-18 Zengyu Zou , Jingyuan Wang , Yixuan Huang , Junjie Wu

In the fifth-generation communication system (5G), multipath-assisted positioning (MAP) has emerged as a promising approach. With the enhancement of signal resolution, multipath component (MPC) are no longer regarded as noise but rather as…

信号处理 · 电气工程与系统科学 2025-06-05 Ye Tian , Xueting Xu , Ao Peng

Target localization is a critical task in sensitive applications, where multiple sensing agents communicate and collaborate to identify the target location based on sensor readings. Existing approaches investigated the use of Multi-Agent…

机器学习 · 计算机科学 2025-01-22 Ahmed Alagha , Rabeb Mizouni , Shakti Singh , Jamal Bentahar , Hadi Otrok

This paper proposes a multi-agent reinforcement learning based medium access framework for wireless networks. The access problem is formulated as a Markov Decision Process (MDP), and solved using reinforcement learning with every network…

机器学习 · 计算机科学 2021-04-30 Hrishikesh Dutta , Subir Biswas

Multi-chiplet architectures enabled by glass interposer offer superior electrical performance, enable higher bus widths due to reduced crosstalk, and have lower capacitance in the redistribution layer than current silicon interposer-based…

硬件体系结构 · 计算机科学 2025-07-25 Harsh Sharma , Janardhan Rao Doppa , Umit Y. Ogras , Partha Pratim Pande
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