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Thermal analysis is crucial in 3D-IC design due to increased power density and complex heat dissipation paths. Although operator learning frameworks such as DeepOHeat~\cite{liu2023deepoheat} have demonstrated promising preliminary results…

机器学习 · 计算机科学 2025-10-13 Xinling Yu , Ziyue Liu , Hai Li , Yixing Li , Xin Ai , Zhiyu Zeng , Ian Young , Zheng Zhang

Since being analyzed by Rokhlin, Szlam, and Tygert and popularized by Halko, Martinsson, and Tropp, randomized Simultaneous Power Iteration has become the method of choice for approximate singular value decomposition. It is more accurate…

数据结构与算法 · 计算机科学 2015-11-02 Cameron Musco , Christopher Musco

Thermal issue is a major concern in 3D integrated circuit (IC) design. Thermal optimization of 3D IC often requires massive expensive PDE simulations. Neural network-based thermal prediction models can perform real-time prediction for many…

机器学习 · 计算机科学 2023-02-28 Ziyue Liu , Yixing Li , Jing Hu , Xinling Yu , Shinyu Shiau , Xin Ai , Zhiyu Zeng , Zheng Zhang

A thermal simulation methodology is developed for interconnects enabled by a data-driven learning algorithm accounting for variations of material properties, heat sources and boundary conditions (BCs). The methodology is based on the…

材料科学 · 物理学 2023-04-18 Wangkun Jia , Ming-C. Cheng

Thermal analysis is increasingly critical in modern integrated circuits, where non-uniform power dissipation and high transistor densities can cause rapid temperature spikes and reliability concerns. Traditional methods, such as FEM-based…

机器学习 · 计算机科学 2026-05-05 Soumyadeep Chandra , Sayeed Shafayet Chowdhury , Kaushik Roy

Quantum simulation of complex many-body systems beyond classical computational capabilities provides a promising route toward understanding novel quantum phases and their transitions. In particular, analog quantum simulators with global…

量子物理 · 物理学 2026-05-11 Shuo Zhang , Yuzhi Tong , Pengfei Zhang , Zeyu Liu

The Realization Independent Iterative Rational Krylov Algorithm (TF-IRKA) is a frequency-based data-driven reduced order modeling (DDROM) method that constructs $\mathcal H_2$ optimal DDROMs. However, as the $\mathcal H_2$ optimal…

数值分析 · 数学 2024-07-18 Michael S. Ackermann , Serkan Gugercin

A model of a multilayer device with non-trivial geometrical structure and nonlinear dependencies of thermodynamic material properties at cryogenic temperatures is suggested. A considered device, called cryogenic cell, is intended for use in…

计算物理 · 物理学 2015-11-20 Alexander Ayriyan , Jan Busa , Eugeny E. Donets , Hovik Grigorian , Jan Pribis

Engineering design processes involve iterative design evaluations requiring numerous computationally intensive numerical simulations. Quantum algorithms promise substantial speedups for specific tasks relevant to engineering simulations.…

量子物理 · 物理学 2026-03-26 Leonhard Hölscher , Lukas Müller , Or Samimi , Tamuz Danzig

One of the crucial steps in the design of an integrated circuit is the minimization of heating and temperature non-uniformity. Current temperature calculation methods, such as finite element analysis and resistor networks have considerable…

材料科学 · 物理学 2007-09-13 T. Kemper , Y. Zhang , Z. Bian , A. Shakouri

Lattice quantum chromodynamics simulations in nuclear physics have benefited from a tremendous number of algorithmic advances such as multigrid and eigenvector deflation. These improve the time to solution but do not alleviate the intrinsic…

高能物理 - 格点 · 物理学 2018-08-09 M. A. Clark , Alexei Strelchenko , Alejandro Vaquero , Mathias Wagner , Evan Weinberg

We present a novel, fast method to compute thermal interactions in solids, useful for time-dependent problems involving several sources and several time and space scales such as the ones encountered in the physics of fields of closed loop…

计算物理 · 物理学 2025-07-25 Marc Basquens , Alberto Lazzarotto

A thermal simulation methodology derived from the proper orthogonal decomposition (POD) and the Galerkin projection (GP), hereafter referred to as PODTherm-GP, is evaluated in terms of its efficiency and accuracy in a multi-core CPU. The GP…

计算工程、金融与科学 · 计算机科学 2023-05-04 Lin Jiang , Anthony Dowling , Ming-C. Cheng , Yu Liu

We consider piecewise polynomial discontinuous Galerkin discretizations of boundary integral reformulations of the heat equation. The resulting linear systems are dense and block-lower triangular and hence can be solved by block forward…

数值分析 · 数学 2024-08-09 Sivaram Ambikasaran , Ritesh Khan , Johannes Tausch , Sihao Wang

The problem of simulating the thermal behavior of quantum systems remains a central open challenge in quantum computing. Unlike well-established quantum algorithms for unitary dynamics, \emph{provably efficient} algorithms for preparing…

量子物理 · 物理学 2026-05-14 Dominik Hahn , Ryan Sweke , Abhinav Deshpande , Oles Shtanko

Large-scale cryogenic Input-Output (IO) infrastructure is a requirement for realising fault-tolerant quantum computing in solid-state modalities. Such IO scaling presents significant challenges in thermal modelling, hardware design and…

量子物理 · 物理学 2025-03-17 Scott A. Manifold , George B. Long , Jonathan J. Burnett

We study scheduling problems motivated by recently developed techniques for microprocessor thermal management at the operating systems level. The general scenario can be described as follows. The microprocessor's temperature is controlled…

数据结构与算法 · 计算机科学 2008-01-29 Marek Chrobak , Christoph Durr , Mathilde Hurand , Julien Robert

Boolean algebra, the branch of mathematics where variables can assume only true or false value, is the theoretical basis of classical computation. The analogy between Boolean operations and electronic switching circuits, highlighted by…

介观与纳米尺度物理 · 物理学 2018-08-08 Federico Paolucci , Giampiero Marchegiani , Elia Strambini , Francesco Giazotto

The IP matrix model is a simple large $N$ quantum mechanical model made up of an adjoint harmonic oscillator plus a fundamental harmonic oscillator. It is a model introduced previously as a toy model of the gauge theory dual of an AdS black…

高能物理 - 理论 · 物理学 2023-06-09 Norihiro Iizuka , Mitsuhiro Nishida

Thermal analysis provides deeper insights into electronic chips behavior under different temperature scenarios and enables faster design exploration. However, obtaining detailed and accurate thermal profile on chip is very time-consuming…

机器学习 · 计算机科学 2022-09-13 Rishikesh Ranade , Haiyang He , Jay Pathak , Norman Chang , Akhilesh Kumar , Jimin Wen
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