相关论文: 3D Electronic-Photonic Heterogenous Interconnect P…
Trapped-ion quantum computing requires precise optical control for individual qubit manipulation. However, conventional free-space optics face challenges in alignment stability and scalability as the number of qubits increases. Integrated…
Vision Transformers (ViTs) have established new performance benchmarks in vision tasks such as image recognition and object detection. However, these advancements come with significant demands for memory and computational resources,…
The demand for integrated photonic chips combining the generation and manipulation of quantum states of light is steadily increasing, driven by the need for compact and scalable platforms for quantum information technologies. While photonic…
Color centers in host semiconductors are prime candidates for spin-photon interfaces that would enable numerous quantum applications. The discovery of an optimal spin-photon interface in silicon would move quantum information technologies…
Optical interconnects are the most promising solution to address the data-movement bottleneck in data centers. Silicon microdisks, benefiting from their compact footprint, low energy consumption, and wavelength division multiplexing (WDM)…
The transition towards designs which co-package electronic and photonic die together in data center switch packages has created a scaling path to Petabyte per second (Pbps) input/output (I/O) in such systems. In a co-packaged design, the…
In the wake of dwindling Moore's Law, to address the rapidly increasing complexity and cost of fabricating large-scale, monolithic systems-on-chip (SoCs), the industry has adopted dis-aggregation as a solution, wherein a large monolithic…
With technology scaling, the size of cache systems in chip-multiprocessors (CMPs) has been dramatically increased to efficiently store and manipulate a large amount of data in future applications and decrease the gap between cores and…
Nonlinear photonic chips are capable of generating and processing signals all-optically with performance far superior to that possible electronically - particularly with respect to speed. Although silicon has been the leading platform for…
The continuous growth in data volume has sparked interest in silicon-organic-hybrid nanophotonic devices integrated into silicon photonic integrated circuits (PICs). SOH devices offer improved speed and energy efficiency compared to silicon…
Hybrid bonding is a pivotal technology for enabling three dimensional integrated circuits. Among the foremost challenges facing 3D IC implementation is thermal management, where a deep understanding of heat conduction across bonded…
We design and demonstrate a monolithically integrated silicon photonic multichannel optical hybrid for versatile broadband coherent reception, addressing the critical limitations of current wavelength multiplexed systems in scalability and…
The recently developed energy conserving semi-implicit method (ECsim) for PIC simulation is applied to multiple scale problems where the electron-scale physics needs to be only partially retained and the interest is on the macroscopic or…
Chiplet-based systems are rapidly gaining traction in the market. Two packaging options for such systems are the established organic substrates and the emerging glass substrates. These substrates are used to implement the inter-chiplet…
Electrical control of light in integrated photonics is central to a wide range of research and applications. It is conventionally achieved with thermo-optic tuning, but this suffers from high energy consumption and crosstalk.…
Photonic integrated circuits (PICs) enable miniaturization of optical quantum circuits because several optic and electronic functionalities can be added on the same chip. Single photon emitters (SPEs) are central building blocks for such…
As computing resource demands continue to escalate in the face of big data, cloud-connectivity and the internet of things, it has become imperative to develop new low-power, scalable architectures. Neuromorphic photonics, or photonic neural…
Hyperspectral point clouds (HPCs) can simultaneously characterize 3D spatial and spectral information of ground objects, offering excellent 3D perception and target recognition capabilities. Current approaches for generating HPCs often…
Silicon photonic integrated circuits offer significant improvements in processing bandwidth, power efficiency, and low latency, addressing the needs of future microwave communication systems. Several successful applications have been…
Solid-state quantum light sources offer a scalable pathway for interfacing stationary spin qubits with flying photonic qubits, forming the backbone of future quantum networks. Telecom-band spin-photonic qubits, operating in the 1260-1675 nm…