相关论文: Teardown Analysis of Samsung S20 Exynos 990 SoC

For the past four decades, cost and features have driven CMOS scaling. Severe lithography and material limitations seen below the 20 nm node, however, are challenging the fundamental premise of affordable CMOS scaling. Just continuing to…

The Scaling of microchip technologies, from micron to submicron and now to deep sub-micron (DSM) range, has enabled large scale systems-on-chip (SoC). In future deep submicron (DSM) designs, the interconnect effect will definitely dominate…

Modern heterogeneous System-on-Chip (SoC) devices integrate advanced components into a single package, offering powerful capabilities while also introducing significant complexity. To manage these sophisticated devices, firmware and…

With at least 50 cores, Intel Xeon Phi is a true many-core architecture. Featuring fairly powerful cores, two cache levels, and very fast interconnections, the Xeon Phi can get a theoretical peak of 1000 GFLOPs and over 240 GB/s. These…

Nowadays System-On-Chips (SoCs) have evolved considerably in term of performances, reliability and integration capacity. The last advantage has induced the growth of the number of cores or Intellectual Properties (IPs) in a same chip.…

This paper introduces a deep level teardown process of a personal medical device - the OmniPod wireless tubeless insulin pump. This starts with mechanical teardown exposing the engineering solutions used inside the device. Then the…

The increasing density of transistors in Integrated Circuits (ICs) has enabled the development of highly integrated Systems-on-Chip (SoCs) and, more recently, Multiprocessor Systems-on-Chip (MPSoCs). To address scalability challenges in…

The management of the energy consumption and thermal dissipation of multi-core heterogeneous platforms is becoming increasingly important as it can have direct impact on the platform performance. This paper discusses an approach that…

In this paper, we explore a cooperative integrated sensing and communication (ISAC) framework that utilizes orthogonal frequency division multiplexing (OFDM) waveforms. Under the control of a central processing unit (CPU), multiple access…

The strong anharmonicity and high coherence times inherent to fluxonium superconducting circuits are beneficial for quantum information processing. In addition to requiring high-quality physical qubits, a quantum processor needs to be…

For a system-level design of Networks-on-Chip for 3D heterogeneous System-on-Chip (SoC), the locations of components, routers and vertical links are determined from an application model and technology parameters. In conventional methods,…

Most previous 3D IC research focused on stacking traditional 2D silicon layers, so the interconnect reduction is limited to inter-block delays. In this paper, we propose techniques that enable efficient exploration of the 3D design space…

RF photonic transversal signal processors, which combine reconfigurable electrical digital signal processing and high-bandwidth photonic processing, provide a powerful solution for achieving adaptive high-speed information processing.…

Today's mobile devices contain densely packaged system-on-chips (SoCs) with multi-core, high-frequency CPUs and complex pipelines. In parallel, sophisticated SoC-assisted security mechanisms have become commonplace for protecting device…

Electronic control systems used for quantum computing have become increasingly complex as multiple qubit technologies employ larger numbers of qubits with higher fidelity targets. Whereas the control systems for different technologies share…

The introduction of complex SoCs with multiple processor cores presents new development challenges, such that development support is now a decisive factor when choosing a System-on-Chip (SoC). The presented developments support strategy…

This review examines the rapidly evolving landscape of ultra-low-power edge processors, covering heterogeneous Systems-on-Chips (SoCs), neural accelerators, near-sensor and in-sensor architectures, and emerging dataflow and memory-centric…

Silicon carbide (SiC) is an essential material for next generation semiconductors and components for nuclear plants. It's applications are strongly dependent on its thermal conductivity, which is highly sensitive to microstructures.…

With high integration density and excellent optical properties, silicon photonics is becoming a promising platform for complete integration and large-scale optical quantum information processing. Scalable quantum information applications…

Designing a system-on-chip (SoC) for deep neural network (DNN) acceleration requires balancing multiple metrics such as latency, power, and area. However, most existing methods ignore the interactions among different SoC components and rely…