相关论文: Evaluating Vulnerability of Chiplet-Based Systems …
Modern computer scaling trends in pursuit of larger component counts and power efficiency have, unfortunately, lead to less reliable hardware and consequently soft errors escaping into application data ("silent data corruptions").…
The transistors used to construct Integrated Circuits (ICs) continue to shrink. While this shrinkage improves performance and density, it also reduces trust: the price to build leading-edge fabrication facilities has skyrocketed, forcing…
Embedded software used in industrial systems frequently relies on data that ensures the correct and efficient operation of these systems. Thus, companies invest considerable resources in fine-tuning this data, making it their valuable…
High Voltage CMOS sensors are a promising technology for tracking detectors in collider experiments. Extensive R&D studies are being carried out by the ATLAS Collaboration for a possible use of HV-CMOS in the High Luminosity LHC upgrade of…
A growing need exists for efficient and accurate methods for detecting defects in semiconductor materials and devices. These defects can have a detrimental impact on the efficiency of the manufacturing process, because they cause critical…
The number of interconnected devices is growing constantly due to rapid digitalization, thus providing attackers with a larger attack surface. Particularly in critical infrastructures and manufacturing, where processes can be observed and…
A deep learning system typically suffers from a lack of reproducibility that is partially rooted in hardware or software implementation details. The irreproducibility leads to skepticism in deep learning technologies and it can hinder them…
Satellites are highly vulnerable to adversarial glitches or high-energy radiation in space, which could cause faults on the onboard computer. Various radiation- and fault-tolerant methods, such as error correction codes (ECC) and…
Silicon detectors typically require an insensitive area around their periphery to accommodate guard rings, which help maintain the electric field uniformity around edge pixels and isolate the high leakage current from the physical edges of…
Monolithic active pixel sensors (MAPS) produced in a 65 nm CMOS imaging technology are being investigated for applications in particle physics. The MAPS design has a small collection electrode characterized by an input capacitance of ~fF,…
The globalization of the semiconductor industry has introduced security challenges to Integrated Circuits (ICs), particularly those related to the threat of Hardware Trojans (HTs) - malicious logic that can be introduced during IC…
Photonic technologies lack non-invasive monitoring tools to inspect the light inside optical waveguides. This is one of the main barriers to large scale of integration, even though photonic platforms are potentially ready to host several…
Large language models (LLMs) are increasingly used to assist developers with code, yet their implementations of cryptographic functionality often contain exploitable flaws. Minor design choices (e.g., static initialization vectors or…
This work presents the design and preliminary performance of a highly-multiplexed superconducting detector readout. The readout system is implemented on the Xilinx ZCU111 RFSoC Evaluation Board. The current design uses 12% of the DSPs, 60%…
With current tools and technology, someone who has physical access to a chip can extract the detailed layout of the integrated circuit (IC). By using advanced visual imaging techniques, reverse engineering can reveal details that are meant…
For many IoT domains, Machine Learning and more particularly Deep Learning brings very efficient solutions to handle complex data and perform challenging and mostly critical tasks. However, the deployment of models in a large variety of…
Reliable hardware connectivity is vital in heterogeneous integrated systems. For example, in digital microfluidics lab-on-a-chip systems, there are hundreds of physical connections required between a micro-electro-mechanical fabricated…
Modern system-in-package (SiP) platforms increasingly adopt reconfigurable interposers to enable plug-and-play chiplet integration across heterogeneous multi-vendor ecosystems. However, this flexibility introduces severe trust challenges,…
Cybersecurity threats in Additive Manufacturing (AM) are an increasing concern as AM adoption continues to grow. AM is now being used for parts in the aerospace, transportation, and medical domains. Threat vectors which allow for part…
Chiplet-based architectures and advanced packaging has emerged as transformative approaches in semiconductor design. While conventional physical design for 2.5D heterogeneous systems typically prioritizes wirelength reduction through tight…