相关论文: 3D-Printed Dielectric Image Lines towards Chip-to-…

Compact and robust waveguide chips are crucial for new integrated terahertz applications, such as high-speed interconnections between processors and broadband short-range wireless communications. Progress on topological photonic crystals…

The growing demand for high-capacity, low-loss short-reach links in highly integrated electronic systems makes it necessary to understand how terahertz (THz) dielectric waveguides behave in realistic PCB-level packaging environments. In…

Terahertz communications is a promising modality for future short-range point-to point wireless data transmission at rates up to terabit per second. A milestone towards this goal is the development of an integrated transmitter and receiver…

This paper reports on a novel compact, low-loss bending technique for additively manufactured dielectric image lines between 140 GHz and 220 GHz. Conventional bending approaches require either large curvature radii or technologically…

Terahertz (THz) fiber that provides high-speed connections is an essential component in THz communication systems. The emerging space-division-multiplexing technology is expected to increase the transmission capacity of THz communications.…

We examine the unusual dispersion and attenuation of transverse electromagnetic waves in the few-THz regime on nanoscale graphene and copper transmission lines. Conventionally, such propagation has been considered to be highly dispersive,…

In chip-to-chip communication, terahertz waves provide a promising approach to achieve high data capacity with improved energy efficiency, effectively bridging the gap between electrical and optical domains. By realizing this potential,…

We explore the potential of 3D metal printing to realize complex conductive terahertz devices. Factors impacting performance such as printing resolution, surface roughness, oxidation, and material loss are investigated via analytical,…

We present the design, manufacturing technique, and characterization of a 3D-printed broadband graded index millimeter wave absorber. The absorber is additively manufactured using a fused filament fabrication (FFF) 3D printer out of a…

In this letter, we propose hybrid metal-dielectric waveguides coupled to 2D materials that provide strong light-matter interaction at THz frequencies. We investigate the properties of the fundamental propagating modes and show that the…

The efficient modulation and control of ultrafast signals on-chip is of central importance in terahertz (THz) communications and a promising route toward sub-diffraction limit THz spectroscopy. Two-dimensional (2D) materials may provide a…

In this work, a novel infinity 3D printing technique is explored to fabricate continuous multi-meter-long low-loss near-zero dispersion suspended-core polypropylene fibers for application in terahertz (THz) communications. Particular…

All-dielectric effective-medium-clad waveguides have been widely exploited in terahertz communications owing to their extremely low loss, low dispersion, and broad bandwidth. In this work, we propose a substrateless effective-medium-slot…

Terahertz bands enable ultra-broadband wireless communications but require compact, low-cost, and efficient transceiver modules. Conventional implementations based on metallic waveguides or silicon lenses suffer from high loss, bulkiness,…

We propose and experimentally demonstrate a photonic routing architecture that can efficiently utilize the space of multi-plane (3D) photonic integration. A wafer with three planes of amorphous silicon waveguides was fabricated and…

Dielectric waveguide (DWG) interconnects frequently utilize multimode waveguides due to their low dispersion in the fundamental mode. However, these links are more vulnerable to cross-modal coupling that significantly impacts their overall…

A combination of gap waveguide technology and the traditional coplanar waveguide is studied in detail and demonstrated experimentally for the first time. This novel metamaterial transmission line is presented in three different…

In this work, a complementary resonant structure etched on the ground plane of a microstrip line is proposed for characterizing dielectric materials. The resonant sensor is designed to operate in S-band (2 to 4 GHz). The sensor is designed…

Photonic integrated circuits (PICs) are vital for developing affordable, high-performance optoelectronic devices that can be manufactured at an industrial scale, driving innovation and efficiency in various applications. Optical loss of…

In the past few years, we have witnessed an increased interest in the use of 2D materials for the realization of hybrid photonic nonlinear waveguides. Although graphene has attracted most of the attention, other families of 2D materials…