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相关论文: Chiplets and the Codelet Model

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When designing new web applications, developers must cope with different kinds of constraints relative to the resources they rely on: software, hardware, network, online micro-services, or any combination of the mentioned entities.…

编程语言 · 计算机科学 2026-02-06 Anna Gallone , Simon Bliudze , Sophie Cerf , Olga Kouchnarenko

Hardware specialization is becoming a key enabler of energyefficient performance. Future systems will be increasingly heterogeneous, integrating multiple specialized and programmable accelerators, each with different memory demands.…

硬件体系结构 · 计算机科学 2021-04-26 Johnathan Alsop , Weon Taek Na , Matthew D. Sinclair , Samuel Grayson , Sarita V. Adve

A core challenge for superconducting quantum computers is to scale up the number of qubits in each processor without increasing noise or cross-talk. Distributed quantum computing across small qubit arrays, known as chiplets, can address…

While Compute Express Link (CXL) enables support for cache-coherent shared memory among multiple nodes, it also introduces new types of failures--processes can fail before data does, or data might fail before a process does. The lack of a…

分布式、并行与集群计算 · 计算机科学 2024-07-18 Yi Xu , Suyash Mahar , Ziheng Liu , Mingyao Shen , Steven Swanson

On the way to Exascale, programmers face the increasing challenge of having to support multiple hardware architectures from the same code base. At the same time, portability of code and performance are increasingly difficult to achieve as…

分布式、并行与集群计算 · 计算机科学 2022-06-14 Thomas Heller , Hartmut Kaiser , Patrick Diehl , Dietmar Fey , Marc Alexander Schweitzer

Chiplet-based integration enables large-scale systems that combine diverse technologies, enabling higher yield, lower costs, and scalability, making them well-suited to AI workloads. Processing-in-Memory (PIM) has emerged as a promising…

硬件体系结构 · 计算机科学 2025-08-15 Alish Kanani , Lukas Pfromm , Harsh Sharma , Janardhan Rao Doppa , Partha Pratim Pande , Umit Y. Ogras

Processing-in-memory (PIM) reduces data movement by executing near memory, but our large-scale characterization on real PIM hardware shows that end-to-end performance is often limited by disjoint host and device address spaces that force…

新兴技术 · 计算机科学 2025-11-20 I-Ting Lee , Bao-Kai Wang , Liang-Chi Chen , Wen Sheng Lim , Da-Wei Chang , Yu-Ming Chang , Chieng-Chung Ho

Heterogeneous computing is the strategy of deploying multiple types of processing elements within a single workflow, and allowing each to perform the tasks to which is best suited. To fully harness the power of heterogeneity, we want to be…

分布式、并行与集群计算 · 计算机科学 2021-12-03 Nikolaos Mavrogeorgis

With the increasing prevalence of chiplet systems in high-performance computing applications, the number of design options has increased dramatically. Instead of chips defaulting to a single die design, now there are options for 2.5D and 3D…

硬件体系结构 · 计算机科学 2025-03-21 Alexander Graening , Jonti Talukdar , Saptadeep Pal , Krishnendu Chakrabarty , Puneet Gupta

The increasing demands for computing performance have been a reality regardless of the requirements for smaller and more energy efficient devices. Throughout the years, the strategy adopted by industry was to increase the robustness of a…

软件工程 · 计算机科学 2019-05-07 Hugo Andrade , Ivica Crnkovic

Matrix extensions have emerged as an essential feature in modern CPUs to address the surging demands of AI workloads. However, existing designs often incur substantial hardware and software design overhead. Tight coupling with the CPU…

Advanced 2.5D Systems-in-Package (SiPs) compose a growing portion of high-performance systems. While the packaging and interconnect choices play a large role in the overall system design, system architects still lack a suitable framework…

硬件体系结构 · 计算机科学 2026-05-28 Zhengping Zhu , Austin Rovinski

To overcome the well-known memory bottleneck of AI chips, 3D stacked architectures that employ advanced packaging technology with high-density through-silicon vias (TSVs) pins have proven to be a promising solution. The 3D-stacked AI chip…

硬件体系结构 · 计算机科学 2026-04-30 Yiqi Liu , Noelle Crawford , Michael Wang , Jilong Xue , Jian Huang

The proliferation of large language models (LLMs) is accelerating the integration of multimodal assistants into edge devices, where inference is executed under stringent latency and energy constraints, often exacerbated by intermittent…

硬件体系结构 · 计算机科学 2026-01-29 Yanru Chen , Runyang Tian , Yue Pan , Zheyu Li , Weihong Xu , Tajana Rosing

Enhancing performance while reducing costs is the fundamental design philosophy of integrated circuits (ICs). With advancements in packaging technology, interposer-based chiplet architecture has emerged as a promising solution. Chiplet…

硬件体系结构 · 计算机科学 2024-11-08 Shixin Chen , Hengyuan Zhang , Zichao Ling , Jianwang Zhai , Bei Yu

Nowadays, data-intensive applications are gaining popularity and, together with this trend, processing-in-memory (PIM)-based systems are being given more attention and have become more relevant. This paper describes an analytical modeling…

To support growing massive parallelism, functional components and also the capabilities of current processors are changing and continue to do so. Todays computers are built upon multiple processing cores and run applications consisting of a…

编程语言 · 计算机科学 2016-04-07 Somnath Mazumdar , Roberto Giorgi

In the past, efforts were taken to improve the performance of a processor via frequency scaling. However, industry has reached the limits of increasing the frequency and therefore concurrent execution of instructions on multiple cores seems…

硬件体系结构 · 计算机科学 2013-09-24 Irfan Uddin

Heterogeneous many-cores are now an integral part of modern computing systems ranging from embedding systems to supercomputers. While heterogeneous many-core design offers the potential for energy-efficient high-performance, such potential…

分布式、并行与集群计算 · 计算机科学 2020-05-11 Jianbin Fang , Chun Huang , Tao Tang , Zheng Wang

Sequential computation is well understood but does not scale well with current technology. Within the next decade, systems will contain large numbers of processors with potentially thousands of processors per chip. Despite this, many…

硬件体系结构 · 计算机科学 2015-11-17 James Hanlon