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相关论文: Machine Learning for Predicting Thermal Transport …

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The fundamental quantity governing the mechanical and thermodynamic properties of a crystalline solid is its electronic charge density. Yet, its direct use for the rapid prediction of materials properties remains challenging due to its high…

材料科学 · 物理学 2026-05-11 Kammampati Sai Kumar , Albert Linda , Shubham Kumar Maurya , Somnath Bhowmick

For multilayer materials in thin substrate systems, interfacial failure is one of the most challenges. The traction-separation relations (TSR) quantitatively describe the mechanical behavior of a material interface undergoing openings,…

计算工程、金融与科学 · 计算机科学 2020-12-01 Jiaxin Zhang , Congjie Wei , Chenglin Wu

Machine learning has become a crucial tool for predicting the properties of crystalline materials. However, existing methods primarily represent material information by constructing multi-edge graphs of crystal structures, often overlooking…

机器学习 · 计算机科学 2024-11-14 Chao Huang , Chunyan Chen , Ling Shi , Chen Chen

Lattice thermal conductivity (TC) of semiconductors is crucial for various applications, ranging from microelectronics to thermoelectrics. Data-driven approach can potentially establish the critical composition-property relationship needed…

材料科学 · 物理学 2022-08-30 Zeyu Liu , Meng Jiang , Tengfei Luo

Polymers, integral to advancements in high-tech fields, necessitate the study of their thermal conductivity (TC) to enhance material attributes and energy efficiency. The TC of polymers obtained by molecular dynamics (MD) calculations and…

应用物理 · 物理学 2024-04-02 Chunbo Lin , Han Zheng

Among all the properties required for the design of the next generation of PCM (density, heat capacity, thermal expansion, latent energy, volume change upon melting, corrosion rate, etc.) the thermal transport properties are by far the…

材料科学 · 物理学 2021-09-28 Anh Thu Phan , Aïmen E. Gheribi , Patrice Chartrand

The density functional theory for superconductors developed in the preceding article [cond-mat/0408685] is applied to the calculation of superconducting properties of several elemental metals. In particular, we present results for the…

Material extrusion is one of the most commonly used approaches within the additive manufacturing processes available. Despite its popularity and related technical advancements, process reliability and quality assurance remain only partially…

The predictive modeling of lattice thermal conductivity is of fundamental importance for the understanding and design of materials for a wide range of applications. Two major approaches, namely molecular dynamics (MD) simulations and…

材料科学 · 物理学 2019-08-14 Marcello Puligheddu , Yi Xia , Maria K. Y. Chan , Giulia Galli

We outline a general approach to the computation of transport properties of interacting systems at low temperetures and frequencies. We show that if the fixed point and the irrelevant operators around it are known, then by studying the…

强关联电子 · 物理学 2009-11-10 Natan Andrei , Efrat Shimshoni , Achim Rosch

Topologically interlocking architectures can generate tough ceramics with attractive thermo-mechanical properties. This concept can make the material design pathway a challenging task, since modeling the whole design space is neither…

计算工程、金融与科学 · 计算机科学 2023-05-22 Elham Kiyani , Hamidreza Yazdani Sarvestani , Hossein Ravanbakhsh , Razyeh Behbahani , Behnam Ashrafi , Meysam Rahmat , Mikko Karttunen

While phonon topology in crystalline solids has been extensively studied, its influence on thermal transport-especially in nanostructures-remains elusive. Here, by combining first-principles-based machine learning potentials with the phonon…

材料科学 · 物理学 2025-12-23 Zhe Su , Shuoran Song , Qi Wang , Jian-Hua Jiang

We perform machine learning (ML) simulations and density functional theory (DFT) calculations to search for materials with low lattice thermal conductivity, $\kappa_L$. Several cadmium (Cd) compounds containing elements from the…

材料科学 · 物理学 2024-11-05 Chia-Min Lin , Abishek Khatri , Da Yan , Cheng-Chien Chen

Although the tailored metal active sites and porous architectures of MOFs hold great promise for engineering challenges ranging from gas separations to catalysis, a lack of understanding of how to improve their stability limits their use in…

材料科学 · 物理学 2021-06-28 Aditya Nandy , Chenru Duan , Heather J. Kulik

Magnetic materials have a plethora of applications ranging from informatics to energy harvesting and conversion. However, such functionalities are limited by the magnetic ordering temperature. In this work, we performed machine learning on…

材料科学 · 物理学 2021-10-06 T. Long , N. M. Fortunato , Yixuan Zhang , O. Gutfleisch , H. Zhang

The limited extrapolative power of structure-based machine learning (ML) models is a critical bottleneck in chemical discovery, particularly for industrial R&D, where navigating uncharted chemical space to find next-generation materials or…

This work summarizes recent progress on the thermal transport properties of three-dimensional (3D) nanostructures, with an emphasis on experimental results. Depending on the applications, different 3D nanostructures can be prepared or…

应用物理 · 物理学 2019-09-16 Haifei Zhan , Yihan Nie , Yongnan Chen , John M. Bell , Yuantong Gu

Heat conduction and radiation are two of the three fundamental modes of heat transfer, playing a critical role in a wide range of scientific and engineering applications ranging from energy systems to materials science. However, traditional…

材料科学 · 物理学 2025-10-31 Ziqi Guo , Daniel Carne , Krutarth Khot , Dudong Feng , Guang Lin , Xiulin Ruan

While using first-principles-based Boltzmann transport equation approach to predict the thermal conductivity of crystalline semiconductor materials has been a routine, the validity of the approach is seldom tested for high-temperature…

介观与纳米尺度物理 · 物理学 2020-03-05 Xiaokun Gu , Shouhang Li , Hua Bao

Polymers are widely used in industry and in our daily life because of their diverse functionality, light weight, low cost and excellent chemical stability. However, on some applications such as heat exchangers and electronic packaging, the…

材料科学 · 物理学 2018-05-16 Congliang Huang , Xin Qian , Ronggui Yang