相关论文: Machine learning thermal circuit network model for…
This paper presents a method to simulate the thermal behavior of 3D systems using a graph neural network. The method discussed achieves a significant speed-up with respect to a traditional finite-element simulation. The graph neural network…
We propose to use Bayesian optimization (BO) to improve the efficiency of the design selection process in clinical trials. BO is a method to optimize expensive black-box functions, by using a regression as a surrogate to guide the search.…
The increasing transistor scale integration poses, among others, the thermal-aware floorplanning problem; consisting of how to place the hardware components in order to reduce overheating by dissipation. Due to the huge amount of feasible…
Thermoelectric coolers (TECs) offer a promising solution for direct cooling of local hotspots and active thermal management in advanced electronic systems. However, TECs present significant trade-offs among spatial cooling, heating and…
We present a Bayesian optimization (BO) framework for tuning model predictive controllers (MPC) of central heating, ventilation, and air conditioning (HVAC) plants. This approach treats the functional relationship between the closed-loop…
With technology scaling down, hundreds and thousands processing elements (PEs) can be integrated on a single chip. Network-on-chip (NoC) has been proposed as an efficient solution to handle this distinctive challenge. In this thesis, we…
The transition to 4th generation district heating creates a growing need for scalable, automated design tools that accurately capture the spatial and temporal details of heating network operation. This paper presents an automated design…
The layout optimization of the heat conduction is essential during design in engineering, especially for thermal sensible products. When the optimization algorithm iteratively evaluates different loading cases, the traditional numerical…
With the increasing power density of electronics components, the heat dissipation capacity of heat sinks gradually becomes a bottleneck. Many structural optimization methods, including topology optimization, have been widely used for heat…
We propose a novel constrained Bayesian Optimization (BO) algorithm optimizing the design process of Laterally-Diffused Metal-Oxide-Semiconductor (LDMOS) transistors while realizing a target Breakdown Voltage (BV). We convert the…
Due to embedded systems` stringent design constraints, much prior work focused on optimizing energy consumption and/or performance. Since embedded systems typically have fewer cooling options, rising temperature, and thus temperature…
Designing thermal radiation metamaterials is challenging especially for problems with high degrees of freedom and complex objective. In this letter, we have developed a hybrid materials informatics approach which combines the adversarial…
Thermal issue is a major concern in 3D integrated circuit (IC) design. Thermal optimization of 3D IC often requires massive expensive PDE simulations. Neural network-based thermal prediction models can perform real-time prediction for many…
The selection of optimal design for power electronic converter parameters involves balancing efficiency and thermal constraints to ensure high performance without compromising safety. This paper introduces a probabilistic-learning-based…
Modern real-time systems utilize considerable amounts of power while executing computation-intensive tasks. The execution of these tasks leads to significant power dissipation and heating of the device. It therefore results in severe…
Combined heat and power economic dispatch (CHPED) problem is a sophisticated constrained nonlinear optimization problem in a heat and power production system for assigning heat and power production to minimize the production costs. To…
Laser-directed-energy deposition (DED) offers advantages in additive manufacturing (AM) for creating intricate geometries and material grading. Yet, challenges like material inconsistency and part variability remain, mainly due to its…
Automatic transistor sizing in circuit design continues to be a formidable challenge. Despite that Bayesian optimization (BO) has achieved significant success, it is circuit-specific, limiting the accumulation and transfer of design…
Leveraging the latent heat of phase change materials (PCMs) can reduce the peak temperatures and transient variations in temperature in electronic devices. But as the power levels increase, the thermal conduction pathway from the heat…
This paper presents a BPD (Balanced Power Dissipation) heuristic scheduling algorithm applied to VLSI CMOS digital circuits/systems in order to reduce the global computational demand and provide balanced power dissipation of computational…