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We have developed two radiation-hard ASICs for optical data transmission in the ATLAS pixel detector at the LHC at CERN: a driver chip for a Vertical Cavity Surface Emitting Laser (VCSEL) diode for 80 Mbit/s data transmission from the…

The time resolution of the second monolithic silicon pixel prototype produced for the MONOLITH H2020 ERC Advanced project was studied using a femtosecond laser. The ASIC contains a matrix of hexagonal pixels with 100 {\mu}m pitch, readout…

We have developed two radiation-hard ASICs for optical data transmission in the ATLAS pixel detector at the LHC at CERN: a driver chip for a Vertical Cavity Surface Emitting Laser (VCSEL) diode for 80 Mbit/s data transmission from the…

The Inner Tracking System (ITS) of the ALICE experiment at the CERN Large Hadron Collider (LHC) is the largest Monolithic Active Pixel Sensor technology application in high-energy physics. The upgraded version of the tracking system, called…

A front-end readout electronics system has been developed for silicon strip detectors. The system uses an application specific integrated circuit (ASIC) ATHED to realize multi-channel E&T measurement. The slow control of ASIC chips is…

The existing ATLAS Tracker will be at its functional limit for particle fluences of 10^15 neq/cm^2 (LHC). Thus for the upgrades at smaller radii like in the case of the planned Insertable B-Layer (IBL) and for increased LHC luminosities…

We present a smart pixel prototype readout integrated circuit (ROIC) designed in CMOS 28 nm bulk process, with in-pixel implementation of an artificial intelligence (AI) / machine learning (ML) based data filtering algorithm designed as…

The ITkPixV2 chip is the final production readout chip for the ATLAS Phase 2 Inner Tracker (ITk) upgrade at the upcoming High-Luminosity LHC (HL-LHC). Due to the extraordinarily high peak luminosity at the HL-LHC of $5 \times 10^{34}$…

In this paper, we propose a two-bit reconfigurable intelligent surface (RIS)-aided communication system, which mainly consists of a two-bit RIS, a transmitter and a receiver. A corresponding prototype verification system is designed to…

Pixel sensors based on commercial high-voltage CMOS processes are an exciting technology that is considered as an option for the outer layer of the ATLAS inner tracker upgrade at the High Luminosity LHC. Here, charged particles are detected…

We have designed three ASICs for possible applications in the optical links of a new layer of pixel detector in the ATLAS experiment for the first phase of the LHC luminosity upgrade. The ASICs include a high-speed driver for the VCSEL, a…

We present the design and the performance of MUX64, a 64-to-1 analogue multiplexer ASIC for the ATLAS High Granularity Timing Detector (HGTD). The MUX64 transmits one of its 64 inputs selected by six address lines for the voltages or…

The upgraded Inner Tracking System (ITS2) of the ALICE experiment at the CERN Large Hadron Collider is based on Monolithic Active Pixel Sensors (MAPS). With a sensitive area of about 10 $m^2$ and 12.5 billion pixels, ITS2 represents the…

The Advanced X-ray Imaging Satellite (AXIS) is a NASA probe class mission concept designed to deliver arcsecond resolution with an effective area ten times that of Chandra (at launch). The AXIS focal plane features an MIT Lincoln Laboratory…

For the High-Luminosity phase of LHC, the ATLAS experiment is proposing the addition of a High Granularity Timing Detector (HGTD) in the forward region to mitigate the effects of the increased pile-up. The chosen detection technology is Low…

The ATLAS inner detector comprises three different sub-detectors: the pixel detector, the silicon strip tracker, and the transition-radiation drift-tube tracker. The Insertable $B$-Layer, a new innermost pixel layer, was installed during…

Following the Phase-II upgrade during Long Shutdown (LS3), the LHC aims to reach a peak instantaneous luminosity of $7.5\times 10^{34}$cm$^{-2}$s$^{-1}$, which corresponds to an average of around 200 inelastic proton-proton collisions per…

We characterize a new x-ray Mixed-Mode Pixel Array Detector (MM-PAD-2.1) Application Specific Integrated Circuit (ASIC). Using an integrating pixel front-end with dynamic charge removal architecture, the MM-PAD-2.1 ASIC extends the maximum…

We present the first characterization results of Timespot1, an ASIC designed in CMOS 28 nm technology, featuring a $32 \times 32$ pixel matrix with a pitch of $55 ~ \mu m$. Timespot1 is the first small-size prototype, conceived to readout…

We present the first results from the HPSoC ASIC designed for readout of Ultra-fast Silicon Detectors. The 4-channel ASIC manufactured in 65 nm CMOS by TSMC has been optimized for 50 um thick AC-LGAD. The evaluation of the analog front end…