相关论文: MuPix and ATLASPix -- Architectures and Results

With the next upgrade of the ALICE inner tracking system (ITS3) as its primary focus, a set of small MAPS test structures have been developed in the 65 nm TPSCo CMOS process. The CE-65 focuses on the characterisation of the analogue charge…

In view of the LHC upgrade phases towards the High Luminosity LHC (HL-LHC), the ATLAS experiment plans to upgrade the Inner Detector with an all-silicon system. The n-on-p silicon technology is a promising candidate to achieve a large area…

Thin planar pixel modules are promising candidates to instrument the inner layers of the new ATLAS pixel detector for HL-LHC, thanks to the reduced contribution to the material budget and their high charge collection efficiency after…

The Timepix particle tracking telescope has been developed as part of the LHCb VELO Upgrade project, supported by the Medipix Collaboration and the AIDA framework. It is a primary piece of infrastructure for the VELO Upgrade project and is…

A network of 16 Medipix-2 (MPX) silicon pixel devices was installed in the ATLAS detector cavern at CERN. It was designed to measure the composition and spectral characteristics of the radiation field in the ATLAS experiment and its…

The ALICE ITS3 project foresees the use of ultra-light MAPS, developed in the 65 nm imaging process, for the vertex detector in the ALICE experiment at the LHC to drastically improve the vertexing performance. This new development,…

This paper describes the integration structures for the silicon strips tracker of the ATLAS detector proposed for the Phase-II upgrade of the Large Hadron Collider (LHC), also referred to as High Luminosity LHC (HL-LHC). In this proposed…

The ALICE ITS3 (Inner Tracking System 3) upgrade project and the CERN EP R&D on monolithic pixel sensors are investigating the feasibility of the Tower Partners Semiconductor Co. 65 nm process for use in the next generation of vertex…

To extend the physics reach of the LHC, accelerator upgrades are planned which will increase the integrated luminosity to beyond 3000 fb^-1 and the pile-up per bunch-crossing by a factor 5 to 10. To cope with the increased occupancy and…

Future space-based X-ray telescope missions are likely to have significantly increased demands on detector read out rates due to increased collection area, and there will be a desire to minimize radiation damage in the interests of…

During the ATLAS phase II upgrade, the tracking system of the ATLAS experiment will be replaced by an all-silicon detector called the inner tracker (ITK) with a pixel detector as the most inner part. The monitoring data of the new system…

This paper presents the characterisation and testing of the first wafer-scale monolithic stitched sensor (MOSS) prototype developed for the ALICE ITS3 upgrade that is to be installed during the LHC Long Shutdown 3 (2026-2030). The MOSS chip…

The Helioseismic Magnetic Imager (HMI) onboard the Solar Dynamics Observatory (SDO) records line-of-sight Dopplergram images of convective flows on the surface. These images are used to obtain the multi-scale convective spectrum. We design…

The development of n-on-p "edgeless" planar pixel sensors being fabricated at FBK (Trento, Italy), aimed at the upgrade of the ATLAS Inner Detector for the High Luminosity phase of the Large Hadron Collider (HL-LHC), is reported. A…

The ITkPixV2 chip is the final production readout chip for the ATLAS Phase 2 Inner Tracker (ITk) upgrade at the upcoming High-Luminosity LHC (HL-LHC). Due to the extraordinarily high peak luminosity at the HL-LHC of $5 \times 10^{34}$…

Semiconductor pixel detectors are widely established in High Energy Physics (HEP) and Medical physics for their high spatial resolution and tracking capabilities. Research on both monolithic detectors and hybrid detectors is ongoing.…

The Topmetal-M is a large area pixel sensor (18 mm * 23 mm) prototype fabricated in a new 130 nm high-resistivity CMOS process in 2019. It contains 400 rows * 512 columns square pixels with the pitch of 40 {\mu}m. In Topmetal-M, a novel…

The Helioseismic and Magnetic Imager (HMI) began near-continuous full-disk solar measurements on 1 May 2010 from the Solar Dynamics Observatory (SDO). An automated processing pipeline keeps pace with observations to produce observable…

We have developed two radiation-hard ASICs for optical data transmission in the ATLAS pixel detector at the LHC at CERN: a driver chip for a Vertical Cavity Surface Emitting Laser (VCSEL) diode for 80 Mbit/s data transmission from the…

This work presents the first measurements performed on the Timespot1 ASIC. As the second prototype developed for the TimeSPOT project, the ASIC features a 32x32 channels hybrid-pixel matrix. Targeted to space-time tracking applications in…