相关论文: Topology optimization of heat sinks for instantane…
The demand for high-performance heat sinks has significantly increased with advancements in computing power and the miniaturization of electronic devices. Among the promising solutions, nanofluids have attracted considerable attention due…
This paper demonstrates the application of the density-based topology optimisation approach for the design of heat sinks and micropumps based on natural convection effects. The problems are modelled under the assumptions of steady-state…
A support structure is required to successfully create structural parts in the powder bed fusion process for additive manufacturing. In this study, we present the topology optimization of a support structure that improves the heat…
A framework for topology optimization of cooling channels is proposed, which paves the way towards automated design of additively-manufactured cooling channels, required in applications such as the efficient heat management of die casting…
A method for density-based topology optimization of heat exchangers with two fluids is proposed. The goal of the optimization process is to maximize the heat transfer from one fluid to the other, under maximum pressure drop constraints for…
This work presents the application of density-based topology optimisation to the design of three-dimensional heat sinks cooled by natural convection. The governing equations are the steady-state incompressible Navier-Stokes equations…
This paper treats topology optimization of natural convection problems. A simplified model is suggested to describe the flow of an incompressible fluid in steady state conditions, similar to Darcy's law for fluid flow in porous media. The…
Topology optimization is used to systematically design contact-aided thermo-mechanical regulators, i.e. components whose effective thermal conductivity is tunable by mechanical deformation and contact. The thermo-mechanical interactions are…
Microchannel heat sinks are an efficient cooling method for semiconductor packages. However, to properly cool increasingly complex and thermally dense circuits, microchannel designs should be improved and expanded on. In this paper,…
The increase in dissipated power per unit area of electronic components sets higher demands on the performance of the heat sink. Also if we continue at our current rate of miniaturisation, laptops and other electronic devices can get heated…
This study presents a generative optimization framework based on a guided denoising diffusion probabilistic model (DDPM) that leverages surrogate gradients to generate heat sink designs minimizing pressure drop while maintaining surface…
This study presents a topology optimization framework for the design of water cooled heat sinks that incorporate voided lattice structures, formulated using a two-layer Darcy-Forchheimer model. Conventional porous heat sinks often suffer…
Artificially designed composite materials consist of microstructures, that exhibit various thermal properties depending on their shapes, such as anisotropic thermal conductivity. One of the representative applications of such composite…
Many computational studies on hotspot microfluidic cooling devices found in the literature rely on simplified assumptions and conventions that do not capture the full complexity of the conjugate thermal problem, such as constant…
In traditional topology optimization, the computing time required to iteratively update the material distribution within a design domain strongly depends on the complexity or size of the problem, limiting its application in real engineering…
We present a B\'ezier-based Multi-Fidelity Thermal Optimization Framework, which is a computationally efficient methodology for the global optimization of 3D heat sinks. The flexible B\'ezier-parameterized fin geometries and the adopted…
The thermal conductivity of Functionally Graded Materials (FGMs) can be efficiently designed through topology optimization to obtain thermal meta-structures that actively steer the heat flow. Compared to conventional analytical design…
As modern electronic devices are increasingly miniaturized and integrated, their performance relies more heavily on effective thermal management. Two-phase cooling methods enhanced by porous surfaces, which capitalize on thin-film…
The continuous increase in computational power of GPUs, essential for advancements in areas like artificial intelligence and data processing, is driving the adoption of liquid cooling in data centers. Skived copper cold plates featuring…
Heat exchangers are devices that typically transfer heat between two fluids. The performance of a heat exchanger such as heat transfer rate and pressure loss strongly depends on the flow regime in the heat transfer system. In this paper, we…