相关论文: Automatic Generation of Equivalent Electrothermal …

Thermal analysis is increasingly critical in modern integrated circuits, where non-uniform power dissipation and high transistor densities can cause rapid temperature spikes and reliability concerns. Traditional methods, such as FEM-based…

Thermally aware design of 2.5D and 3D advanced packaging systems will require fast, accurate, and powerful thermal analysis of chiplets, stacks, and packages. These systems contain multiple materials with non-linear heat transfer properties…

Based on simplified one-dimensional steady-state analysis of thermoelectric phenomena and on analogies between thermal and electrical domains, we propose both lumped and distributed parameter electrical models for thermoelectric devices.…

We propose a system of nonlinear integral equations (NLIE), which gives the free energy of the osp(1|2s) integrable spin chain at finite temperatures. In contrast with usual thermodynamic Bethe ansatz equations, our new NLIE contain only a…

The increasing power densities and intricate heat dissipation paths in advanced 2.5D/3D chiplet systems necessitate thermal modeling frameworks that deliver detailed thermal maps with high computational efficiency. Traditional compact…

Despite the rapidly evolving field of computational electromagnetics, few open-source tools have managed to tackle the problem of automatic mesh generation for properly discretizing the problem of interest into a finite set of elements…

We present a finite-element simulation tool for calculating light fields in 3D nano-optical devices. This allows to solve challenging problems on a standard personal computer. We present solutions to eigenvalue problems, like Bloch-type…

Linear programming is used as a standard tool for optimising unit commitment or power flows in energy supply systems. For heat supply systems, however, it faces a relevant limitation: For them, energy yield depends on the output…

By combining Three Dimensional Integrated Circuits with the Network-on-Chip infrastructure to obtain 3D Networks-on-Chip (3D-NoCs), the new on-chip communication paradigm brings several advantages on lower power, smaller footprint and lower…

Computationally expensive temperature and power grid analyses are required during the design cycle to guide IC design. This paper employs encoder-decoder based generative (EDGe) networks to map these analyses to fast and accurate…

The self-organized Monte Carlo simulations of 2D Ising ferromagnet on the square lattice are performed. The essence of devised simulation method is the artificial dynamics consisting of the single-spin-flip algorithm of Metropolis…

We describe a simple technique for generating a cold-atom lattice pierced by a uniform magnetic field. Our method is to extend a one-dimensional optical lattice into the "dimension" provided by the internal atomic degrees of freedom,…

We propose an adaptive optimization algorithm for operating district heating networks in a stationary regime. The behavior of hot water flow in the pipe network is modeled using the incompressible Euler equations and a suitably chosen…

To resolve the rising temperatures in 3.5D-ICs, a thermal-aware design flow becomes increasingly crucial, necessitating an accurate and efficient thermal simulation tool. However, previous tools struggle to handle the unique heterogeneous…

We discuss recently introduced numerical linked-cluster (NLC) algorithms that allow one to obtain temperature-dependent properties of quantum lattice models, in the thermodynamic limit, from exact diagonalization of finite clusters. We…

This paper analyzes a transient thermo-electromagnetic problem arising in the modeling of induction heating processes. Unlike previous studies that focused on steady-state scenarios, we consider a time-dependent thermal problem coupled with…

Rapid growth in artificial intelligence (AI) workloads is driving up data center power densities, increasing the need for advanced thermal management. Direct-to-chip liquid cooling can remove heat efficiently at the source, but many cold…

A sampling calorimeter equipped with gaseous sensor layers with digital readout is near perfect for "Particle Flow Algorithm" approach, since it is homogeneous over large surfaces, robust, cost efficient, easily segmentable to any readout…

The FLAME methodology makes it possible to derive provably correct algorithms from a formal description of a linear algebra problem. So far, the methodology has been successfully used to automate the derivation of direct algorithms such as…

This work builds on the previous introduction [1] of a coupled experimental-computational system devised to fully characterize the thermal behavior of complex 3D submicron electronic devices. The new system replaces the laser-based surface…