中文
相关论文

相关论文: Thermal Design of Power Electronic Circuits

200 篇论文

Quantum heat transfer through a generic superconducting set-up consisting of a tunable transmon qubit placed between resonators that are termined by thermal reservoirs is explored. Two types of architectures are considered, a sequential and…

量子物理 · 物理学 2021-03-24 Meng Xu , J. T. Stockburger , J. Ankerhold

This paper deals with an analytical modeling of heat transfers simulating a new radiation calorimeter operating in a temperature range from -50 {\deg}C to 150 {\deg}C. The aim of this modeling is the evaluation of the feasibility and…

仪器与探测器 · 物理学 2016-01-11 Elysée Obame Ndong , Olivier Gallot-Lavallée , Frédéric Aitken

Growth of intermittent renewable energy and climate change make it increasingly difficult to manage electricity demand variability. Centralized storage can help but is costly. An alternative is to shift demand. Cooling and heating demands…

系统与控制 · 电气工程与系统科学 2024-02-23 Michael J. Roberts , Sisi Zhang , Eleanor Yuan , James Jones , Matthias Fripp

The increase in dissipated power per unit area of electronic components sets higher demands on the performance of the heat sink. Also if we continue at our current rate of miniaturisation, laptops and other electronic devices can get heated…

其他计算机科学 · 计算机科学 2010-04-07 B. Sri Aravindh , T. R. Gopalakrishnan Nair

The emerging field of phase-coherent caloritronics (from the Latin word "calor", i.e., heat) is based on the possibility to control heat currents using the phase difference of the superconducting order parameter. The goal is to design and…

介观与纳米尺度物理 · 物理学 2017-10-09 Antonio Fornieri , Francesco Giazotto

Two principles govern the critical temperature for superconducting transitions: (1)~intrinsic strength of the pair coupling and (2)~effect of the many-body environment on the efficiency of that coupling. Most discussions take into account…

超导电性 · 物理学 2020-04-09 Mike Guidry , Yang Sun , Lian-Ao Wu

Large power consumption of silicon CMOS electronics is a challenge in very-large-scale integrated circuits and a major roadblock to fault-tolerant quantum computation. Matching the power dissipation of Si-MOSFETs to the thermal budget at…

The low thermal conductivity of silicon nanostructures, with respect to bulk silicon, opens excellent possibilities for thermoelectric applications because it will enable the use of silicon for the high efficient direct conversion of wasted…

应用物理 · 物理学 2021-03-29 Antonella Masci , Elisabetta Dimaggio , Giovanni Pennelli

Heat dissipation is one of the most serious problems in modern integrated electronics with the continuously decreasing devices size. Large portion of the consumed power is inevitably dissipated in the form of waste heat which not only…

应用物理 · 物理学 2021-07-21 Xue Gong , Ruijie Qian , Huanyi Xue , Weikang Lu , Zhenghua An

Modern multiprocessor system-on-chips (SoCs) integrate multiple heterogeneous cores to achieve high energy efficiency. The power consumption of each core contributes to an increase in the temperature across the chip floorplan. In turn,…

系统与控制 · 计算机科学 2018-06-19 Ganapati Bhat , Suat Gumussoy , Umit Y. Ogras

Technological progress in electronics usually requires their use in increasingly aggressive environments, such as rapid thermal cycling and high power density. Thermal diodes appear as excellent candidates to thermally protect critical…

计算物理 · 物理学 2023-08-16 L. Zurdo , L. Chej , A. Monastra , F. Carusela

Among numerous challenges to meet the rising global energy demand in a sustainable manner, improving phase change heat transfer has been at the forefront of engineering research for decades. The high heat transfer rates associated with…

The complex time-dependent heat and electromagnetic energy transfer in a new type of cooling system is analyzed. The system consists of a cold body, a Peltier element and an electric circuit containing an inductor with controllable…

应用物理 · 物理学 2020-02-11 Viorel Badescu

Our paper presents a non-destructive thermal transient measurement method that is able to reveal differences even in the micron size range of MEMS structures. Devices of the same design can have differences in their sacrificial layers as…

其他计算机科学 · 计算机科学 2007-11-29 P. Szabo , B. Nemeth , M. Rencz , B. Courtois

The temperature of the semiconductor diode increases under strong light illumination whether thermoelectric cooler is installed or not, which changes the output wavelength of the laser (Lee M. S. et al., 2017). However, other…

量子物理 · 物理学 2018-03-22 Yang-Yang Fei , Xiang-Dong Meng , Ming Gao , Yi Yang , Hong Wang , Zhi Ma

Active thermal control is crucial in achieving the required accuracy and throughput in many industrial applications, e.g., in the medical industry, high-power lighting industry, and semiconductor industry. Thermoelectric Modules (TEMs) can…

系统与控制 · 电气工程与系统科学 2020-06-19 Enzo Evers , Rens Slenders , Rob van Gils , Tom Oomen

Quantum thermal transistor is a microscopic thermodynamical device that can modulate and amplify heat current through two terminals by the weak heat current at the third terminal. Here we study the common environmental effects on a quantum…

量子物理 · 物理学 2022-01-04 Yu-qiang Liu , Deng-hui Yu , Chang-shui Yu

Heat transfer and dissipation exists in almost any physical, chemical or biological systems. Cells, as the basic unit of life, undergo continuous heat transfer and dissipation during their metabolism. The heat transfer and dissipation…

生物物理 · 物理学 2019-01-03 Pei Song , He Gao , Miao Zhang , Fan Yang , Shan-Shan Li , Bin Kang , Jing-Juan Xu , Hong-Yuan Chen

A quantum thermal transistor is designed by the strong coupling between one qubit and one qutrit which are in contact with three heat baths with different temperatures. The thermal behavior is analyzed based on the master equation by both…

量子物理 · 物理学 2019-03-12 Bao-qing Guo , Tong Liu , Chang-shui Yu

In a multiprocessor system on chip (MPSoC) IC the processor is one of the highest heat dissipating devices. The temperature generated in an IC may vary with floor plan of the chip. This paper proposes an integration and thermal analysis…

新兴技术 · 计算机科学 2012-01-24 Ramya Menon C. , Vinod Pangracious