相关论文: Condensation and growth of Kirkendall voids in int…
The electroâmechanical connection between under bump metallization (UBM) and solder in flipâchip bonding is achieved by the formation of brittle intermetallic compounds (IMCs) during the soldering process. These IMCs continue to grow in…
A novel computational treatment of dense, stiff, coupled reaction rate equations is introduced to study the nucleation, growth, and possible coalescence of cavities during neutron irradiation of metals. Radiation damage is modeled by the…
We present a comprehensive study of voids formation, nucleation and growth in a prototype model of binary alloys subjected to irradiation by using a combined approach based on phase field and rate theories. It is shown that voids formation…
Voids can limit the life of engineering components. This motivates us to understand local plasticity around voids in a nickel base superalloy combining experiments and simulations. Single crystal samples were deformed in tension with…
In this study, the crack propagation of the pre-cracked mono-crystal nickel with the voids and inclusions has been investigated by molecular dynamics simulations. Different sizes of voids, inclusions and materials of inclusions are used to…
An experimental methodology is developed to evaluate size effects in nanovoids deformation under macroscopic uniaxial stress loading conditions. Quantitative evaluation of voids deformation as a function of voids size shows both a…
The microstructure of a second-generation nickel base superalloy is studied using X-ray computed tomography (XCT) and scanning electron microscopy (SEM). The as-cast material contains 0.15 (+-0.001) vol% voids and these are distributed in…
Unpredictable Kirkendall void formation at the interface of circuit interconnections underlies degradation in electronics, yet there is a lack of effective approaches to curb the amount of these voids. Here we developed a strain-anneal…
The presence of bifurcation of the Kirkendall marker plane, a very special phenomenon discovered recently, is found in a technologically important Cu Sn system. It was predicted based on estimated diffusion coefficients; however, could not…
The fracture process of commercially pure titanium was visualized in model materials containing artificial holes. These model materials were fabricated using a femtosecond laser coupled with a diffusion bonding technique to obtain voids in…
The process of fracture in ductile metals involves the nucleation, growth, and linking of voids. This process takes place both at the low rates involved in typical engineering applications and at the high rates associated with dynamic…
Slow crack propagation in ductile, and in certain brittle materials, appears to take place via the nucleation of voids ahead of the crack tip due to plastic yields, followed by the coalescence of these voids. Post mortem analysis of the…
We present a novel method for simulation of the interior of large cosmic voids, suitable for study of the formation and evolution of objects lying within such regions. Following Birkhoff's theorem, void regions dynamically evolve as…
In this work, we integrate different computational tools based on multi-phase-field simulations to account for the evolution of morphologies and crystallographic defects of Cu/Sn/Cu sandwich interconnect structures that are widely used in…
Despite the growing level of technological advancement that characterizes extrusion-deposition additive manufacturing technology, there remains a significant knowledge gap in fully understanding the process-structure-property relationship…
In this work, the spallation processes in the ductile metals are systematically discussed in theory. By employing the phase transition theory and non-equilibrium transport theory, the spallation processes of ductile metals under dynamic…
A theoretical model of the formation of an amorphous phase during the quenching of a metallic melt is proposed. It has been shown that the appearance of a significant temperature gradient during the quenching of a metallic melt leads to…
Using a carefully justified development of Debye-Huckel theory for highly asymmetric electrolytes, one finds that a region of expanded phase instability, or miscibility gap, can appear for charge-stabilised colloidal suspensions at high…
Ductile damage in sheet steels is caused by voids. It is crucial for product design to predict the distribution of voids in bent components. Since the void volume fraction is a state variable in the Gurson-Tvergaard-Needleman (GTN) model,…
The ductile fracture process in porous metals due to growth and coalescence of micron scale voids is not only affected by the imposed stress state but also by the distribution of the voids and the material size effect. The objective of this…