相关论文: Novel Bonding technologies for wafer-level transpa…
Curved and conformal optics offer significant advantages by unlocking additional geometric degrees of freedom for optical design. These capabilities enable enhanced optical performance and are essential for meeting non-optical constraints,…
The ability to design the scattering properties of electromagnetic structures is of fundamental interest in optical science and engineering. While there has been great practical success applying local optimization methods to electromagnetic…
In the past fifteen years mathematical models for microelectromechanical systems (MEMS) have been the subject of several studies, in particular due to the interesting qualitative properties they feature. Still most research is devoted to an…
Micro-Electro-Mechanical Systems (MEMS) normally have fixed or moving structures (plates or array of thin beams) with cross-sections of the order of microns and lengths of the order of tens or hundreds of microns. Electrostatic forces play…
Informing Additive Manufacturing (AM) technology adoption decisions, this paper investigates the relationship between build volume capacity utilisation and efficient technology operation in an inter-process comparison of the costs of…
Optical metasurfaces (OMSs) have shown unprecedented capabilities for versatile wavefront manipulations at the subwavelength scale, thus opening fascinating perspectives for next generation ultracompact optical devices and systems. However,…
The field of microelectromechanical Systems (MEMS) for photonic integrated circuits (PICs) is reviewed. This field leverages mechanics at the nanometer to micrometer scale to improve existing components and introduce novel functionalities…
Soft electronics are a promising and revolutionary alternative for traditional electronics when safe physical interaction between machines and the human body is required. Among various materials architectures developed for producing soft…
Hybrid polymer-plasmonic nanostructures might combine high enhancement of localized fields from metal nanoparticles with light confinement and long-range transport in subwavelength dielectric structures. Here we report on the complex…
Efficient, low-loss, and versatile optical modulators are a critical ingredient for practical integrated photonic systems. Modulators based on micro-electromechanical systems (MEMS) have unique advantages over more traditional thermal,…
This paper presents the different processing steps of a new generic surface micromachining module for MEMS hermetic packaging at temperatures around 180 degrees C based on nickel plating and photoresist sacrificial layers. The advantages of…
The vast majority of modern microelectronic devices rely on carriers within semiconductors due to their integrability. Therefore, the performance of these devices is limited due to natural semiconductor properties such as band gap and…
Microelectromechanical systems (MEMS) that require contact of moving parts to implement complex functions exhibit limits to their performance and reliability. Here, we advance our particle tracking method to measure MEMS motion in operando…
This paper presents two approaches: the virtual element method (VEM) and the stabilization-free virtual element method (SFVEM) for analyzing thermomechanical behavior in electronic packaging structures with geometric multi-scale features.…
Varifocal lenses, conventionally implemented by changing the axial distance between multiple optical elements, have a wide range of applications in imaging and optical beam scanning. The use of conventional bulky refractive elements makes…
Wave-domain processing is an emerging paradigm where signal processing operations are partially shifted from the digital to the electromagnetic (EM) domain. Leveraging reconfigurable EM devices, this approach aims to reduce complexity,…
Two-dimensional (2D) materials like transition metal dichalcogenides (TMD) have proved to be serious candidates to replace silicon in several technologies with enhanced performances. In this respect, the two remaining challenges are the…
This paper considers a developing theory on the effects of inevitable process variations during the fabrication of MEMS and other microsystems. The effects on the performance and design yield of the microsystems devices are analyzed and…
Wafer-level testing is an important step for process and quality control of electronic chips in integrated circuit (IC) manufacturing which occurs before packaging. The process of wafer probing in its conventional contacting schemes,…
Advancement of molecular devices will critically depend on the approach to establish electrical connections to the functional molecule(s). We produced a molecular device strategy which is based on chemically attaching of molecules between…