相关论文: Thermal Transient Multisource Simulation Using Cub…

This work addresses the simulation of heat flow and electric currents in thin wires. An important application is the use of bond wires in microelectronic chip packaging. The heat distribution is modeled by an electrothermal coupled problem,…

This paper analyzes a transient thermo-electromagnetic problem arising in the modeling of induction heating processes. Unlike previous studies that focused on steady-state scenarios, we consider a time-dependent thermal problem coupled with…

We present a temperature extrapolation technique for self-consistent many-body methods, which provides a causal starting point for converging to a solution at a target temperature. The technique employs the Carath\'eodory formalism for…

In this paper we report on a novel simulation tool designed for the 3D coupled electro-thermal simulation of Smart Power Mosfets, that is a tool capable of taking into account not only the electrical (and thermal) behaviour of the power…

We present a novel hybrid incompressible flow/material point method solver for simulating the combustion of flammable solids. Our approach utilizes a sparse grid representation of solid materials in the material point method portion of the…

The paper addresses a two-temperature model for simulating compressible two-phase flow taking into account diffusion processes related to the heat conduction and viscosity of the phases. This model is reduced from the two-phase…

Additive manufacturing and welding processes are highly sensitive to heat dissipation, where improper thermal management leads to residual stresses, distortions, and cracking. Existing heat transfer models, such as Rosenthal's solutions,…

This paper will deal with the modeling-problem of combining thermal subsystems (e.g. a semiconductor module or package with a cooling radiator) making use of reduced models. The subsystem models consist of a set of Foster-type thermal…

In this work I present a technique of construction and fast evaluation of a family of cubic polynomials for analytic smoothing and graphical rendering of particles trajectories for flows in a generic geometry. The principal result of the…

Metasurfaces are becoming important tools for the control of thermal radiation. Understanding their functional possibilities on computational grounds requires evaluating the response of the biperiodic layered system for many degrees of…

Thermodynamics of a pseudospin-electron model without correlations is investigated. The correlation functions, the mean values of pseudospin and particle number, as well as the thermodynamic potential are calculated. The calculation is…

Many computational studies on hotspot microfluidic cooling devices found in the literature rely on simplified assumptions and conventions that do not capture the full complexity of the conjugate thermal problem, such as constant…

Using the general framework of the snowplow model, we introduce the equations for computing plasma temperature in Z pinch discharges. We also present expressions to quantify energy transfers in Z pinch discharges. We then apply this…

A coupled cohesive zone model based on an analogy between fracture and contact mechanics is proposed to investigate debonding phenomena at imperfect interfaces due to thermomechanical loading and thermal fields in bodies with cohesive…

In this work, a thermal energy transfer problem in a one-dimensional multilayer body is theoretically analyzed, considering diffusion, advection, internal heat generation or loss linearly dependent on temperature in each layer, as well as…

This paper presents a novel method to estimate the power consumption of distinct active components on an electronic carrier board by using thermal imaging. The components and the board can be made of heterogeneous material such as plastic,…

Thermal properties of a two-layered composite conductor are modified in case the interface is damaged. The present paper deals with nondestructive evaluation of perturbations of interface thermal conductance due to the presence of defects.…

Developing high power density electronics requires effective and highly reliable cooling techniques with low thermal resistance and high heat removal capacity. Loop heat pipes (LHPs) are one kind of two-phase heat transfer device which can…

Cooling of ions or other charged particles in electromagnetic traps is an essential tool to achieve control over their degrees of freedom on the quantum level. For many objects, there is no viable route for direct cooling, such as an…

The thermal sensitive electrical parameter (TSEP) method is crucial for enhancing the reliability of power devices through junction temperature monitoring. The TSEP method comprises three key processes: calibration, regression, and…