相关论文: Ultrafast Temperature Profile Calculation in Ic Ch…

Accurate on-chip temperature sensing is critical for the optimal performance of modern CMOS integrated circuits (ICs), to understand and monitor localized heating around the chip during operation. The development of quantum computers has…

We present a new technique of VLSI chip-level thermal analysis. We extend a newly developed method of solving two dimensional Laplace equations to thermal analysis of four adjacent materials on a mother board. We implement our technique in…

We investigate the theoretical foundations of the simulated tempering method and use our findings to design efficient algorithms. Employing a large deviation argument first used for replica exchange molecular dynamics [Plattner et al., J.…

IR cameras are widely used for temperature measurements in various applications, including agriculture, medicine, and security. Low-cost IR cameras have the immense potential to replace expensive radiometric cameras in these applications;…

Low-cost thermal cameras are inaccurate (usually $\pm 3^\circ C$) and have space-variant nonuniformity across their detector. Both inaccuracy and nonuniformity are dependent on the ambient temperature of the camera. The goal of this work…

Virtual Data Center (VDC) embedding has drawn significant attention recently because of growing need for efficient and flexible means of Data Center (DC) resource allocation. Existing studies on VDC embedding mainly focus on improving DCs'…

Accurate thermal analysis of composites and porous media requires detailed characterization of local thermal properties in small scale. For some important applications such as lithium-ion batteries, changes in the properties during the…

This paper demonstrates the use of voltage noise thermometry, with a cross-correlation technique, as a dissipation-free method of thermometry inside a CMOS integrated circuit (IC). We show that this technique exhibits broad agreement with…

The thermal response function given to a unit-step dissipation accurately characterizes the thermal system. Instead of the thermal response function the so-called structure function describing three-dimensional as the equivalent model of…

Boolean algebra, the branch of mathematics where variables can assume only true or false value, is the theoretical basis of classical computation. The analogy between Boolean operations and electronic switching circuits, highlighted by…

Interconnect is one of the main performance determinant of modern integrated circuits (ICs). The new technology of vertical ICs places circuit blocks in the vertical dimension in addition to the conventional horizontal plane. Compared to…

Foundation models, such as CNNs and ViTs, have powered the development of image representation learning. However, general guidance to model architecture design is still missing. Inspired by the connection between image representation…

In collisional ionization equilibrium (CIE), the X-ray spectrum from a plasma depends on the distribution of emission measure over temperature (DEM). Due to the well-known ill conditioning problem, no precisely resolved DEM can be inverted…

A calculation method for engine temperatures is presented. Special focus is placed on the transient and scattering boundary conditions within the combustion chamber, including fired and coasting conditions, as well as the dynamic heat…

In the present work, we consider the industrial problem of estimating in real-time the mold-steel heat flux in continuous casting mold. We approach this problem by first considering the mold modeling problem (direct problem). Then, we plant…

The paper presents numerical results on an innovative concept of an efficient, site-specific cooling technology for microprocessor hot spots using Alternating Current Electrothermal Flow (ACET). ACET deploys an electrokinetic transport…

Laser melting, such as that encountered during additive manufacturing (AM), produces extreme gradients of temperature in both space and time, which in turn influence microstructural development in the material. Qualification and model…

Block-sparse regularization is already well-known in active thermal imaging and is used for multiple measurement based inverse problems. The main bottleneck of this method is the choice of regularization parameters which differs for each…

We demonstrate the measurement and manipulation of the temperature of cold CO molecules in a microchip environment. Through the use of time-resolved spatial imaging, we are able to observe the phase-space distribution of the molecules, and…

We introduce a computational framework to statistically infer thermophysical properties of any given wall from in-situ measurements of air temperature and surface heat fluxes. The proposed framework uses these measurements, within a…