相关论文: Optimised Curing of Silver Ink Jet Based Printed T…
The ability to control electromagnetic fields on the subwavelength scale could open exciting new venues in many fields of science. Transformation optics provides one way to attain such control through the local variation of the permittivity…
The electron spin is emerging as a new powerful tool in the electronics and optics industries. Many proposed applications involve the creation of spin currents, which so far have proven to be difficult to produce in semiconductor…
Building on our prior work, where our team transcended self assembled molecular monolayers (SAMs) research from a 2D configuration to 3D structured materials and successfully introduced the molecular self assembled 3D printer to fabricate…
This paper presents a novel method to parallel fabricate large area (wafer scale) metallic nano-split-ring arrays with nanoimprint lithography (NIL). To our knowledge it is the first method that can pattern large area and high dense…
The low thermal conductivity of silicon nanostructures, with respect to bulk silicon, opens excellent possibilities for thermoelectric applications because it will enable the use of silicon for the high efficient direct conversion of wasted…
Controlled integration of metallic nanoparticles (NPs) onto photonic nanostructures enables realization of complex devices for extreme light confinement and enhanced light-matter interaction. This can be achieved combining…
Inkjet printing technology achieves the precise deposition of liquid-phase materials via the digitally controlled formation of picoliter-sized droplets. Beyond graphical printing, inkjet printing has been employed for the deposition of…
Hyperuniform patterns present enhanced physical properties that make them the new generation of cutting-edge technological devices. Synthesizing devices with tens of thousands of components arranged in a hyperuniform fashion has thus become…
Organic printed electronics has proven its potential as an essential enabler for applications related to healthcare, entertainment, energy and distributed intelligent objects. The possibility of exploiting solution-based and direct-writing…
Scaling-up from prototype systems to dense arrays of ions on chip, or vast networks of ions connected by photonic channels, will require developing entirely new technologies that combine miniaturized ion trapping systems with devices to…
Thin films of the prototypical charge transfer insulator NiO appear to be a promising material for novel nanoelectronic devices. The fabrication of the material is challenging however, and mostly a p-type semiconducting phase is reported.…
Adapting electronics to perfectly conform to non-planar and rough surfaces, such as human skin, is a very challenging task which, if solved, could open up new applications in fields of high economic and scientific interest ranging from…
A new flash (ultra-rapid) spark plasma sintering method applicable to various materials systems, regardless of their electrical resistivity, is developed. A number of powders ranging from metals to electrically insulative ceramics have been…
The digitalization of manufacturing has created opportunities for consumers to customize products that fit their individualized needs which in turn would drive demand for manufacturing services. However, this pull-based manufacturing system…
Metamaterials are artificially engineered devices that go beyond the properties of conventional materials in nature. Metamaterials allow the creation of negative refractive indexes, light trapping with epsilon-near-zero compounds, bandgap…
The modification of electronic band structures and the subsequent tuning of electrical, optical, and thermal material properties is a central theme in the engineering and fundamental understanding of solid-state systems. In this scenario,…
The realization of optoelectronic devices on paper has been an outstanding challenge due to the large surface roughness and incompatible nature of paper with optical materials. Here, we demonstrate a new class of optoelectronic devices on a…
This paper reports on formation of high aspect micro patterns on low temperature co-fired ceramic (LTCC) substrates by integrating micro inkjetting with electroless plating. Micro inkjetting was realized by using an inkjetting printer that…
Three-dimensional (3D) printing of bioelectronics offers a versatile platform for fabricating personalized and structurally integrated electronic systems within biological scaffolds. Biodegradable electronics, which naturally dissolve after…
Precision and chip contamination-free placement of two-dimensional (2D) materials is expected to accelerate both the study of fundamental properties and novel device functionality. Current transfer methods of 2D materials onto an arbitrary…