Related papers: ATMPlace: Analytical Thermo-Mechanical-Aware Place…
Chiplet-based architectures and advanced packaging has emerged as transformative approaches in semiconductor design. While conventional physical design for 2.5D heterogeneous systems typically prioritizes wirelength reduction through tight…
The rapid growth of electronics has accelerated the adoption of 2.5D integrated circuits, where effective automated chiplet placement is essential as systems scale to larger and more heterogeneous chiplet assemblies. Existing placement…
2.5D integration technology is gaining traction as it copes with the exponentially growing design cost of modern integrated circuits. A crucial part of a 2.5D stacked chip is a low-latency and high-throughput inter-chiplet interconnect…
Chiplets are modular integrated circuits that can be combined to form a larger system, offering flexibility and performance enhancements. However, their dense packing often leads to significant thermal management challenges, requiring…
The increasing power densities and intricate heat dissipation paths in advanced 2.5D/3D chiplet systems necessitate thermal modeling frameworks that deliver detailed thermal maps with high computational efficiency. Traditional compact…
In this paper, we present a new analytical 3D placement framework with a bistratal wirelength model for F2F-bonded 3D ICs with heterogeneous technology nodes based on the electrostatic-based density model. The proposed framework, enabled…
Rapidly evolving artificial intelligence and machine learning applications require ever-increasing computational capabilities, while monolithic 2D design technologies approach their limits. Heterogeneous integration of smaller chiplets…
2.5D integration is an important technique to tackle the growing cost of manufacturing chips in advanced technology nodes. This poses the challenge of providing high-performance inter-chiplet interconnects (ICIs). As the number of chiplets…
Multi-chiplet architectures enabled by glass interposer offer superior electrical performance, enable higher bus widths due to reduced crosstalk, and have lower capacitance in the redistribution layer than current silicon interposer-based…
Global placement, a critical step in designing the physical layout of computer chips, is essential to optimize chip performance. Prior global placement methods optimize each circuit design individually from scratch. Their neglect of…
Industry adoption of chiplets has been growing as chiplets are a cost-effective option for making large, high-performance systems. Consequently, partitioning large systems into chiplets is increasingly important. In this work, we introduce…
Chiplet-based systems, integrating various silicon dies manufactured at different integrated circuit technology nodes on a carrier interposer, have garnered significant attention in recent years due to their cost-effectiveness and…
Enhancing performance while reducing costs is the fundamental design philosophy of integrated circuits (ICs). With advancements in packaging technology, interposer-based chiplet architecture has emerged as a promising solution. Chiplet…
This paper presents an innovative approach to 3D mixed-size placement in heterogeneous face-to-face (F2F) bonded 3D ICs. We propose an analytical framework that utilizes a dedicated density model and a bistratal wirelength model,…
Timing optimization during global placement is critical for achieving optimal circuit performance and remains a key challenge in modern Field Programmable Gate Array (FPGA) design. As FPGA designs scale and heterogeneous resources increase,…
By interconnecting smaller chiplets through an interposer, 2.5D integration offers a cost-effective and high-yield solution to implement large-scale modular systems. Nevertheless, the underlying network is prone to deadlock, despite…
We propose a flat, analytic, mixed-size placement algorithm ePlace-3D for three-dimension integrated circuits (3D-ICs) using nonlinear optimization. Our contributions are (1) electrostatics based 3D density function with globally uniform…
Thermally aware design of 2.5D and 3D advanced packaging systems will require fast, accurate, and powerful thermal analysis of chiplets, stacks, and packages. These systems contain multiple materials with non-linear heat transfer properties…
Placement is an essential task in modern chip design, aiming at placing millions of circuit modules on a 2D chip canvas. Unlike the human-centric solution, which requires months of intense effort by hardware engineers to produce a layout to…
This paper presents the novel idea of multi-placement structures, for a fast and optimized placement instantiation in analog circuit synthesis. These structures need to be generated only once for a specific circuit topology. When used in…