Related papers: High Density Hybridisation Using ENIG Bumping and …
High-frequency electromagnetic fields (EMFs) are increasingly recognized either as environmental risk factors or as tools for electromagnetic attacks, which are difficult to detect in situ. Existing high-frequency EMF sensors face…
The Adaptive Gain Integrating Pixel Detector (AGIPD) is an x-ray imager, custom designed for the European x-ray Free-Electron Laser (XFEL). It is a fast, low noise integrating detector, with an adaptive gain amplifier per pixel. This has an…
We present an R&D activity focused on the development of novel modules for the upgrade of the ATLAS pixel system at the High Luminosity LHC (HL-LHC). The modules consist of n-in-p pixel sensors, 100 or 200 $\mu$m thick, produced at VTT…
Amorphous silicon carbide (a-SiC) has emerged as a compelling candidate for applications in integrated photonics, known for its high refractive index, high optical quality, high thermo-optic coefficient, and strong third-order…
The hybrid pixel detectors used in the high energy physics experiments currently under construction use a three dimensional connection technique, the so-called bump bonding. As the pitch below 100um, required in these applications, cannot…
The reliability of bump connection structures has become a critical aspect of future silicon detectors for particle physics. The High Granularity Timing Detector (HGTD) for the ATLAS experiment at the High-Luminosity Large Hadron Collider…
Accelerometers offer motion sensing capabilities across a wide range of areas, enabling navigational awareness in consumer goods and defense applications, and playing a key role in monitoring and control systems. To date, on-chip…
Metal-organic frameworks (MOFs) are promising materials for gas sensing but are often limited to single-use detection. We demonstrate a hybridization strategy synergistically deploying conductive MOFs (cMOFs) and conductive polymers (cPs)…
Dense waveguides are the basic building blocks for photonic integrated circuits (PIC). Due to the rapidly increasing scale of PIC chips, high-density integration of waveguide arrays working with low crosstalk over broadband wavelength range…
The transmission electron microscope facilitates the highest-resolution imaging of any instrument ever created, and its limiting factor is no longer spatial resolution but dose efficiency. Low electron doses avoid sample damage but produce…
Recently deep learning-based methods have been applied in image compression and achieved many promising results. In this paper, we propose an improved hybrid layered image compression framework by combining deep learning and the traditional…
Increasing the efficiency and reducing the footprint of on-chip photodetectors enables dense optical interconnects for emerging computational and sensing applications. Avalanche photodetectors (APD) are currently the dominating on-chip…
Efficient coupling of III-V light sources to silicon photonic circuits is one of the key challenges of integrated optics. Important requirements are low coupling losses, as well as small footprint and high yield of the overall assembly,…
Real-world multimodal systems routinely face missing-input scenarios, and in reality, robots lose audio in a factory or a clinical record omits lab tests at inference time. Standard fusion layers either preserve robustness or calibration…
Photonic integrated circuits have emerged as a scalable platform for optical computing, communication, and quantum technologies, where high-fidelity optical processing is essential. However, as photonic systems scale in complexity,…
High-performance photonic chips provide a powerful platform for analog computing, enabling the simulation of high-dimensional physical systems using low-dimensional devices with additional synthetic dimensions. The realization of…
The coupling between multiple nanocavities in close vicinity leads to hybridization of their modes. Stacked Metal/Insulator/Metal (MIM) nanocavities constitute a highly versatile and very interesting model system to study and engineer such…
The wafer scale integration of carbon nanotubes (CNT) remains a challenge for electronic and electromechanical applications. We propose a novel CNT integration process relying on the combination of controlled capillary assembly and buried…
The development of an innovative position sensitive pixelated sensor to detect and measure with high precision the coordinates of the ionizing particles is proposed. The silicon avalanche pixel sensors (APiX) is based on the vertical…
Efficient fiber-to-chip couplers for multi-port access to photonic integrated circuits are paramount for a broad class of applications, ranging, e.g., from telecommunication to photonic computing and quantum technologies. While…