Related papers: High Density Hybridisation Using ENIG Bumping and …
It is demonstrated that a {\veck}-dependence of the hybridization matrix element between $f$- and conduction electrons can give rise to an anisotropic hybridization gap of heavy fermions if the filling of electrons corresponds to that of…
We demonstrate that in photonic gap antennas composed of an epsilon-near-zero (ENZ) layer embedded within a high-index dielectric, hybrid modes emerge from the strong coupling between the ENZ thin film and the photonic modes of the…
Silicon photonic devices are poised to enter high volume markets such as data-communications, telecommunications, biological sensing, and optical phased arrays; however, permanently attaching a fiber to the photonic chip with high optical…
Dense waveguide arrays with half-wavelength-pitch, low-crosstalk, broadband, and flexible routing capability are essential for integrated photonics. However, achieving such performance is challenging due to the relatively weaker confinement…
The new generation internal beam dump of the Super Proton Synchrotron (SPS) at CERN will have to dissipate approximately 270 kW of thermal power, deposited by the primary proton beam. For this purpose, it is essential that the cooling…
We demonstrate strong coupling of gigahertz-frequency nanomechanical resonators to a frequency-tunable superconducting microwave resonator via a galvanically bonded flip-chip method. By tuning the microwave resonator with an external…
The European XFEL, currently under construction, will produce a coherent X-ray pulse every 222 ns in pulse trains of up to 2700 pulses. In conjunction with the fast 2D area detectors currently under development, it will be possible to…
In this research, a novel contact resistance model for the flat panel display (FPD) packaging based on the within layer parallel and between layers series resistance concepts was proposed. The FJ2530 anisotropic conductive films (ACF) by…
The MALTA CMOS monolithic silicon pixel sensors has been developed in the Tower 180 nm CMOS imaging process. It includes an asynchronous readout scheme and complies with the ATLAS inner tracker requirements for the HL-LHC. Several 4-chip…
Hybridization of pixel detector systems has to satisfy tight requirements: high yield, long term reliability, mechanical stability, thermal compliance and robustness have to go together with low passive mass added to the system, radiation…
Image compression is a widely used technique to reduce the spatial redundancy in images. Recently, learning based image compression has achieved significant progress by using the powerful representation ability from neural networks.…
Reliable integration of photonic integrated circuits (PICs) into quantum sensors has the potential to drastically reduce sensor size, ease manufacturing scalability, and improve performance in applications where the sensor is subject to…
In the fourth generation Audio Video coding Standard (AVS4), the Inter Prediction Filter (INTERPF) reduces discontinuities between prediction and adjacent reconstructed pixels in inter prediction. The paper proposes a low complexity…
Multimodal embeddings serve as a bridge for aligning vision and language, with the two primary implementations -- CLIP-based and MLLM-based embedding models -- both limited to capturing only global semantic information. Although numerous…
Efficient fiber-to-chip coupling has been a major hurdle to cost-effective packaging and scalable interconnections of photonic integrated circuits. Conventional photonic packaging methods relying on edge or grating coupling are constrained…
Electromagnetic crimping is a high-velocity joining method to join highly conductive workpieces where a pulsed magnetic field is applied without any working medium or mechanical contact to deform the workpiece. This work explores…
Numerical simulations by means of the Monte Carlo method have been performed to study the electrical properties of a two-dimensional composite filled with rodlike particles. The main goal was to study the effect of the alignment of such…
The transition towards designs which co-package electronic and photonic die together in data center switch packages has created a scaling path to Petabyte per second (Pbps) input/output (I/O) in such systems. In a co-packaged design, the…
Hybrid organic-inorganic nanomaterials can exhibit transitional behavior that deviates from models developed for all-organic or all-inorganic materials systems. Here, we reveal the complexity of exciton-phonon interactions in a recently…
Monolithic Active Pixel Sensors (MAPS) in advanced CMOS imaging technologies are key to next-generation tracking systems for high-energy physics, where radiation hardness and precise vertex reconstruction are essential. As part of the ALICE…