Related papers: Leveraging 3D Technologies for Hardware Security: …
Compressive displays are an emerging technology exploring the co-design of new optical device configurations and compressive computation. Previously, research has shown how to improve the dynamic range of displays and facilitate…
This work studies the role of inter-user device-to-device (D2D) cooperation for improving physical-layer secret communication in multi-user downlink systems. It is assumed that there are out-of-band D2D channels, on each of which a selected…
Intrusion Detection Systems (IDS) are key components for securing critical infrastructures, capable of detecting malicious activities on networks or hosts. The procedure of implementing a IDS for Internet of Things (IoT) networks is not…
Internet of Things (IoT) is a rapidly growing industry currently being integrated into both consumer and industrial environments on a wide scale. While the technology is available and deployment has a low barrier of entry in future…
Intrusion detection systems (IDS) are essential for protecting computer systems and networks against a wide range of cyber threats that continue to evolve over time. IDS are commonly categorized into two main types, each with its own…
In response to the growing demand for enhanced performance and power efficiency, the semiconductor industry has witnessed a paradigm shift toward heterogeneous integration, giving rise to 2.5D/3D chips. These chips incorporate diverse…
Recent years have seen significant advances in using formal verification to check hardware security properties. Of particular practical interest are checking confidentiality and integrity of secrets, by checking that there is no information…
Integrated Circuits (ICs) are the target of diverse attacks during their lifetime. Fabrication-time attacks, such as the insertion of Hardware Trojans, can give an adversary access to privileged data and/or the means to corrupt the IC's…
In this paper, we propose a physical layer security scheme that exploits a novel index modulation (IM) technique for coordinate interleaved orthogonal designs (CIOD). Utilizing the diversity gain of CIOD transmission, the proposed scheme,…
Undoubtedly faster, larger and lower power per bit, but just how do you go about interfacing a DDR3 SDRAM DIMM to an FPGA? The DDR3 standard addresses the faster, more bandwidth and lower power per bit need, but it introduces new design…
To counter software reverse engineering or tampering, software obfuscation tools can be used. However, such tools to a large degree hard-code how the obfuscations are deployed. They hence lack resilience and stealth in the face of many…
In this paper, we address two main problems in the context of covert cyber-attacks in cyber-physical systems (CPS). First, we aim to investigate and develop necessary and sufficient conditions in terms of disruption resources of the CPS…
Internet of Things (IoT) brings new challenges to the security solutions of computer networks. So far, intrusion detection system (IDS) is one of the effective security tools, but the vast amount of data that is generated by heterogeneous…
In today's integrated circuit (IC) ecosystem, owning a foundry is not economically viable, and therefore most IC design houses are now working under a fabless business model. In order to overcome security concerns associated with the…
The proliferation of electronic devices has greatly transformed every aspect of human life, such as communication, healthcare, transportation, and energy. Unfortunately, the global electronics supply chain is vulnerable to various attacks,…
Conventional 2D CMOS technology is reaching fundamental scaling limits, and interconnect bottleneck is dominating integrated circuit (IC) power and performance. While 3D IC technologies using Through Silicon Via or Monolithic Inter-layer…
Two dimensional (2D) integration has been the traditional approach for IC integration. Due to increasing demands for providing electronic devices with superior performance and functionality in more efficient and compact packages, has driven…
This paper discusses recent research that aims to enable computation close to data, an approach we broadly call processing-in-memory (PIM). PIM places computation mechanisms in or near where the data is stored (i.e., inside memory chips or…
The exciting field of stretchable electronics (SE) promises numerous novel applications, particularly in-body and medical diagnostics devices. However, future advanced SE miniature devices will require high-density, extremely stretchable…
Using a multi-layered printed circuit board, we propose a 3D architecture suitable for packaging supercon- ducting chips, especially chips that contain two-dimensional qubit arrays. In our proposed architecture, the center strips of the…