Using a multi-layered printed circuit board, we propose a 3D architecture suitable for packaging supercon- ducting chips, especially chips that contain two-dimensional qubit arrays. In our proposed architecture, the center strips of the buried coplanar waveguides protrude from the surface of a dielectric layer as contacts. Since the contacts extend beyond the surface of the dielectric layer, chips can simply be flip-chip packaged with on-chip receptacles clinging to the contacts. Using this scheme, we packaged a multi-qubit chip and per- formed single-qubit and two-qubit quantum gate operations. The results indicate that this 3D architecture provides a promising scheme for scalable quantum computing.
@article{arxiv.1705.02586,
title = {Extensible 3D architecture for superconducting quantum computing},
author = {Qiang Liu and Mengmeng Li and Kunzhe Dai and Ke Zhang and Guangming Xue and Xinsheng Tan and Haifeng Yu and Yang Yu},
journal= {arXiv preprint arXiv:1705.02586},
year = {2017}
}