Related papers: Leveraging 3D Technologies for Hardware Security: …
Intrusion detection systems (IDS) are crucial security measures nowadays to enforce network security. Their task is to detect anomalies in network communication and identify, if not thwart, possibly malicious behavior. Recently, machine…
Chiplet-based architectures and advanced packaging has emerged as transformative approaches in semiconductor design. While conventional physical design for 2.5D heterogeneous systems typically prioritizes wirelength reduction through tight…
Intrusion Detection Systems (IDSs) are integral to safeguarding networks by detecting and responding to threats from malicious traffic or compromised devices. However, standalone IDS deployments often fall short when addressing the…
Intellectual property (IP) piracy has become a non-negligible problem as the integrated circuit (IC) production supply chain is becoming increasingly globalized and separated that enables attacks by potentially untrusted attackers. Logic…
In this paper we discuss the security of a distributed inner product (DIP) protocol [IEEE TIFS, 11(1), (2016), 59-73]. We show information leakage in this protocol that does not happen in an ideal execution of DIP functionality. In some…
2.5D chiplet systems have been proposed to improve the low manufacturing yield of large-scale chips. However, connecting the chiplets through an electronic interposer imposes a high traffic load on the interposer network. Silicon photonics…
The fourth industrial revolution leads to an increased use of embedded computation and intercommunication in an industrial environment. While reducing cost and effort for set up, operation and maintenance, and increasing the time to…
3D integration has the potential to improve the scalability and performance of Chip Multiprocessors (CMP). A closed form analytical solution for optimizing 3D CMP cache hierarchy is developed. It allows optimal partitioning of the cache…
Additive Manufacturing (AM, or 3D printing) is a novel manufacturing technology that is being adopted in industrial and consumer settings. However, the reliance of this technology on computerization has raised various security concerns. In…
Past attacks against industrial control systems (ICS) show that adversaries often target both the ICS network and the physical process to achieve potential catastrophic impact. To secure ICS, intrusion detection systems promise timely…
We study the problem of defending a Cyber-Physical System (CPS) consisting of interdependent components with heterogeneous sensitivity to investments. In addition to the optimal allocation of limited security resources, we analyze the…
Systems-on-chip (SoCs) are becoming heterogeneous: they combine general-purpose processor cores with application-specific hardware components, also known as accelerators, to improve performance and energy efficiency. The advantages of…
With the increasing prevalence of chiplet systems in high-performance computing applications, the number of design options has increased dramatically. Instead of chips defaulting to a single die design, now there are options for 2.5D and 3D…
We propose a modification to the transpiler of a quantum computer to safeguard against side-channel attacks aimed at learning information about a quantum circuit. We demonstrate that if it is feasible to shield a specific subset of gates…
Monolithic 3D integration has become a promising solution for future computing needs. The metal inter-layer via (MIV) forms interconnects between substrate layers in Monolithic 3D integration. Despite small size of MIV, the area overhead…
Digital infrastructures are seeing convergence and connectivity at unprecedented scale. This is true for both current critical national infrastructures and emerging future systems that are highly cyber-physical in nature with complex…
Embedded systems are parts of our daily life and used in many fields. They can be found in smartphones or in modern cars including GPS, light/rain sensors and other electronic assistance mechanisms. These systems may handle sensitive data…
In this paper, a design space exploration of power delivery networks is performed for multi-chip 2.5-D and 3-D IC technologies. The focus of the paper is the effective placement of the voltage regulator modules (VRMs) for power supply noise…
Modern multi-core systems have a large number of design parameters, most of which are discrete-valued, and this number is likely to keep increasing as chip complexity rises. Further, the accurate evaluation of a potential design choice is…
The semiconductor industry's rapid advancement pushes conventional two-dimensional technology to its utmost limitations in terms of scaling, performance, and cost factors. These challenges drive the usage of 3D technology in the production…