Related papers: Leveraging 3D Technologies for Hardware Security: …
Photonic integrated circuits utilize various waveguide materials, each excelling in specific metrics like efficient light emission, low propagation loss, high electro-optic efficiency, and potential for mass production. Inherent…
Data Distribution Service (DDS) is an innovative approach towards communication in ICS/IoT infrastructure and robotics. Being based on the cross-platform and cross-language API to be applicable in any computerised device, it offers the…
Side-channel attacks have become a severe threat to the confidentiality of computer applications and systems. One popular type of such attacks is the microarchitectural attack, where the adversary exploits the hardware features to break the…
Parallel and monolithic 3D integration directions offer pathways to realize 3D integrated circuits (ICs) but still lead to layer-by-layer implementations, each functional layer being composed in 2D first. This mindset causes challenging…
Functional aspects as well as the influence of integration technology on the system behavior have to be considered in the 3D integration design process of micro systems. Therefore, information from different physical domains has to be…
Modern computing workloads demand energy-efficient, high-bandwidth interconnects, motivating photonic interposers as an alternative to electrical links. Here we demonstrate a compact 3D silicon nitride (SiN) photonic interposer prototype…
The semiconductor industry is experiencing a significant shift from traditional methods of shrinking devices and reducing costs. Chip designers actively seek new technological solutions to enhance cost-effectiveness while incorporating more…
The Large Intelligent Surface (LIS) is a promising technology in the areas of wireless communication, remote sensing and positioning. It consists of a continuous radiating surface located in the proximity of the users, with the capability…
This paper considers the use of novel technologies for mitigating attacks that aim at compromising intrusion detection systems (IDSs). Solutions based on collaborative intrusion detection networks (CIDNs) could increase the resilience…
Supervisory Control and Data Acquisition (SCADA) systems face the absence of a protection technique that can beat different types of intrusions and protect the data from disclosure while handling this data using other applications,…
Dynamic Information Flow Tracking (DIFT) is a technique to track potential security vulnerabilities in software and hardware systems at run time. The last fifteen years have seen a lot of research work on DIFT, including both hardware-based…
Malicious peripherals designed to attack their host computers are a growing problem. Inexpensive and powerful peripherals that attach to plug-and-play buses have made such attacks easy to mount. Making matters worse, commodity operating…
The semiconductor industry is fully globalized and integrated circuits (ICs) are commonly defined, designed and fabricated in different premises across the world. This reduces production costs, but also exposes ICs to supply chain attacks,…
A finite impulse response (FIR) filter is a ubiquitous block in digital signal processing applications. Its characteristics are determined by its coefficients, which are the intellectual property (IP) for its designer. However, in a…
Threats associated with the untrusted fabrication of integrated circuits (ICs) are numerous: piracy, overproduction, reverse engineering, hardware trojans, etc. The use of reconfigurable elements (i.e., look-up tables as in FPGAs) is a…
Three Dimensional Integrated Circuits (3D IC) offer lower power consumption, higher performance, higher bandwidth, and scalability over the conventional two dimensional ICs. Through-Silicon Via (TSV) is one of the fabrication mechanisms…
In the current industrial revolution, additive manufacturing (AM) embodies a promising technology that can enhance the effectiveness, adaptability, and competitiveness of supply chains (SCs). Moreover, it facilitates the development of…
The promise of Additive Manufacturing (AM) includes reduced transportation and warehousing costs, reduction of source material waste, and reduced environmental impact. AM is extremely useful for making prototypes and has demonstrated the…
Integrated circuits (ICs) are essential to modern electronic systems, yet they face significant risks from physical reverse engineering (RE) attacks that compromise intellectual property (IP) and overall system security. While IC camouflage…
Optical imaging technologies are central to discovery in the life and physical sciences, yet their impact depends on how readily they can be built, adapted, and sustained across laboratories. Digital fabrication, including desktop 3D…