Related papers: Leveraging 3D Technologies for Hardware Security: …
2.5D integration is an important technique to tackle the growing cost of manufacturing chips in advanced technology nodes. This poses the challenge of providing high-performance inter-chiplet interconnects (ICIs). As the number of chiplets…
Today's systems are overwhelmingly designed to move data to computation. This design choice goes directly against at least three key trends in systems that cause performance, scalability and energy bottlenecks: (1) data access from memory…
The rise of hardware-level security threats, such as side-channel attacks, hardware Trojans, and firmware vulnerabilities, demands advanced detection mechanisms that are more intelligent and adaptive. Traditional methods often fall short in…
With the exponential rise in the use of cloud services, smart devices, and IoT devices, advanced cyber attacks have become increasingly sophisticated and ubiquitous. Furthermore, the rapid evolution of computing architectures and memory…
Modern integrated circuits are essentially two-dimensional (2D). Partial three-dimensional (3D) integration and 3D-transistor-level integrated circuits have long been anticipated as routes to improve the performance, cost and size of…
With the widespread use of deep neural networks(DNNs) in intelligent systems, DNN accelerators with high performance and energy efficiency are greatly demanded. As one of the feasible processing-in-memory(PIM) architectures,…
The complexity of modern integrated circuits (ICs) necessitates collaboration between multiple distrusting parties, including thirdparty intellectual property (3PIP) vendors, design houses, CAD/EDA tool vendors, and foundries, which…
Poor DRAM technology scaling over the course of many years has caused DRAM-based main memory to increasingly become a larger system bottleneck. A major reason for the bottleneck is that data stored within DRAM must be moved across a…
Modern computing systems are limited in performance by the memory bandwidth available to processors, a problem known as the memory wall. Processing-in-Memory (PIM) promises to substantially improve this problem by moving processing closer…
Side-channel attacks on microprocessors, like the RISC-V, exhibit security vulnerabilities that lead to several design challenges. Hence, it is imperative to study and analyze these security vulnerabilities comprehensively. In this paper,…
Diffusion Models (DMs) achieve state-of-the-art synthesis results in image generation and have been applied to various fields. However, DMs sometimes seriously violate user privacy during usage, making the protection of privacy an urgent…
AI systems have found a wide range of real-world applications in recent years. The adoption of edge artificial intelligence, embedding AI directly into edge devices, is rapidly growing. Despite the implementation of guardrails and safety…
The power consumption of a microprocessor is a huge channel for information leakage. While the most popular exploitation of this channel is to recover cryptographic keys from embedded devices, other applications such as mobile app…
Timing side-channel attacks pose a major threat to embedded systems due to their ease of accessibility. We propose CIDPro, a framework that relies on dynamic program diversification to mitigate timing side-channel leakage. The proposed…
Monolithic 3D (M3D) technology enables high density integration, performance, and energy-efficiency by sequentially stacking tiers on top of each other. M3D-based network-on-chip (NoC) architectures can exploit these benefits by adopting…
There are increasing concerns about possible malicious modifications of integrated circuits (ICs) used in critical applications. Such attacks are often referred to as hardware Trojans. While many techniques focus on hardware Trojan…
A long-standing challenge is the design of chips resilient to faults and glitches. Both fine-grained gate diversity and coarse-grained modular redundancy have been used in the past. However, these approaches have not been well-studied under…
Three-dimensional integrated circuits promise power, performance, and footprint gains compared to their 2D counterparts, thanks to drastic reductions in the interconnects' length through their smaller form factor. We can leverage the…
Modern semiconductor integrated circuits are increasingly fabricated at untrusted third party foundries. There now exist myriad security threats of malicious tampering at the hardware level and hence a clear and pressing need for new tools…
The mass integration and deployment of intelligent technologies within critical commercial, industrial and public environments have a significant impact on business operations and society as a whole. Though integration of these critical…