Related papers: Performance studies of the CE-65v2 MAPS prototype …
Within the context of the ALICE ITS3 collaboration, a set of MAPS small-scale test structures were developed using the 65 nm TPSCo CMOS imaging process with the upgrade of the ALICE inner tracking system as its primary focus. One such…
The ALICE ITS3 project foresees the use of ultra-light MAPS, developed in the 65 nm imaging process, for the vertex detector in the ALICE experiment at the LHC to drastically improve the vertexing performance. This new development,…
In the context of the CERN EP R&D on monolithic sensors and the ALICE ITS3 upgrade, the Tower Partners Semiconductor Co (TPSCo) 65 nm process has been qualified for use in high energy physics, and adopted for the ALICE ITS3 upgrade. An…
The next generation of MAPS for future tracking detectors will have to meet stringent requirements placed on them. One such detector is the ALICE ITS3 that aims to be very light at 0.07% X/X$_{0}$ per layer and have a low power consumption…
Monolithic active pixel sensors (MAPS) produced in a 65 nm CMOS imaging technology are being investigated for applications in particle physics. The MAPS design has a small collection electrode characterized by an input capacitance of ~fF,…
CMOS Pixel Sensors tend to become relevant for a growing spectrum of charged particle detection instruments. This comes mainly from their high granularity and low material budget. However, several potential applications require a higher…
Monolithic Active Pixel Sensors (MAPS) in advanced CMOS imaging technologies are key to next-generation tracking systems for high-energy physics, where radiation hardness and precise vertex reconstruction are essential. As part of the ALICE…
The upgraded Inner Tracking System (ITS2) of the ALICE experiment at the CERN Large Hadron Collider is based on Monolithic Active Pixel Sensors (MAPS). With a sensitive area of about 10 $m^2$ and 12.5 billion pixels, ITS2 represents the…
CMOS pixel sensors (CPS) represent a novel technological approach to building charged particle detectors. CMOS processes allow to integrate a sensing volume and readout electronics in a single silicon die allowing to build sensors with a…
The ALICE Inner Tracking System has been recently upgraded to a full silicon detector consisting entirely of MAPS, arranged in seven concentric layers around the LHC beam pipe. Further ahead, during the LHC Long Shutdown 3, the ALICE…
The Inner Tracking System (ITS) Upgrade for the ALICE experiment at LHC is the first large-area ($\sim$10~m$^2$) silicon vertex detector based on the CMOS Monolithic Active Pixel Sensor (MAPS) technology, which combines sensitive volume and…
The ALICE experiment will upgrade the innermost three layers of its vertexing detector, the Inner Tracking System (ITS), during the next LHC Long Shutdown (LS3) with a novel, bent, ultra-light MAPS-based tracker. Six wafer-scale sensor…
Analogue test structures were fabricated using the Tower Partners Semiconductor Co. CMOS 65 nm ISC process. The purpose was to characterise and qualify this process and to optimise the sensor for the next generation of Monolithic Active…
The Inner Tracking System (ITS) of the ALICE experiment at CERN will undergo an upgrade during the LHC long shutdown 3, in which the three innermost tracking layers will be replaced. This upgrade, named the Inner Tracking System 3 (ITS3),…
Pixel sensors based on commercial high-voltage CMOS processes are an exciting technology that is considered as an option for the outer layer of the ATLAS inner tracker upgrade at the High Luminosity LHC. Here, charged particles are detected…
The high integration density of MAPS, with silicon sensor and readout electronics implemented in the same device, allows very thin structures with a greatly reduced material budget. Thicknesses of $\mathcal{O}$(50~$\mu$m), values at which…
CERN's strategic R&D programme on technologies for future experiments recently started investigating the TPSCo 65nm ISC CMOS imaging process for monolithic active pixels sensors for application in high energy physics. In collaboration with…
During LHC Long Shutdown 3, the ALICE experiment will replace the three innermost layers of its Inner Tracking System (ITS2) with a new vertex detector, the ITS3. This new detector will be assembled using wafer-scale, stitched Monolithic…
Active Pixel Sensor (APS) technology has shown promise for next-generation vertex detectors. This paper discusses the design and testing of two generations of APS chips. Both are arrays of 128 by 128 pixels, each 20 by 20 micro-m. Each…
Thin planar pixel modules are promising candidates to instrument the inner layers of the new ATLAS pixel detector for HL-LHC, thanks to the reduced contribution to the material budget and their high charge collection efficiency after…