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The ALICE collaboration is preparing an upgrade of the three innermost layers of the current Inner Tracking System (ITS) during the next LHC long shutdown (LS3). The new ITS detector will use wafer-scale (up to \SI{27}{cm} in length)…

This study is focused on an investigation of the performance of the Short Strip module developed by the ATLAS Inner Tracker (ITk) strip collaboration using electron beams of energy 5.4 GeV and 5.8 GeV at the DESY-II Testbeam Facility. The…

The ATLAS collaboration will replace its tracking detector with new all silicon pixel and strip systems. This will allow to cope with the higher radiation and occupancy levels expected after the 5-fold increase in the luminosity of the LHC…

The silicon pixel sensor is the core component of the vertex detector for the Circular Electron Positron Collider~(CEPC). The JadePix3 is a full-function large-size CMOS chip designed for the CEPC vertex detector. To test all the functions…

The design, construction and performance of the H1 silicon vertex detector is described. It consists of two cylindrical layers of double sided, double metal silicon sensors read out by a custom designed analog pipeline chip. The analog…

The CERN-RD50 CMOS working group develops the RD50-MPWseries of monolithic high-voltage CMOS pixel sensors for potential use in future high luminosity experiments such as the HL-LHC and FCC-hh. In this contribution, the design of the latest…

The development of CMOS pixel sensors with column parallel read-out and integrated zero-suppression has resulted in a full size, nearly 1 Megapixel, prototype with ~100 \mu s read-out time. Its performances are quite close to the ILD vertex…

This work presents the first measurements performed on the Timespot1 ASIC. As the second prototype developed for the TimeSPOT project, the ASIC features a 32x32 channels hybrid-pixel matrix. Targeted to space-time tracking applications in…

Recent advances in CMOS imaging sensor technology , e.g. in CMOS pixel sensors, have proven that the CMOS process is radiation tolerant enough to cope with certain radiation levels required for tracking layers in hadron collider…

A PC based high speed silicon microstrip beam telescope consisting of several independent modules is presented. Every module contains an AC-coupled double sided silicon microstrip sensor and a complete set of analog and digital signal…

We present a smart pixel prototype readout integrated circuit (ROIC) designed in CMOS 28 nm bulk process, with in-pixel implementation of an artificial intelligence (AI) / machine learning (ML) based data filtering algorithm designed as…

Monolithic Active Pixel Sensors (MAPS) have been developed since the late 1990s based on silicon substrates with a thin epitaxial layer (thickness of 10-15 $\mu$m) in which charge is collected on an electrode, albeit by disordered and slow…

In high-energy physics, there is a need to investigate alternative silicon sensor concepts that offer cost-efficient, large-area coverage. Sensors based on CMOS imaging technology present such a silicon sensor concept for tracking…

In view of the High Luminosity LHC, the current CMS tracking detector will have to be replaced during Long Shutdown 3 to cope with the higher radiation environment and to withstand an increased data rate. To prepare for the so-called CMS…

This letter presents the design of a monolithic pixel sensor with 10x10 micron^2 pixels in OKI 0.15 micron fully depleted SOI technology and first results of its characterisation. The response of the chip to charged particles has been…

The proposed Circular Electron Positron Collider (CEPC) imposes new challenges for the vertex detector in terms of high resolution, low material, fast readout and low power. The Monolithic Active Pixel Sensor (MAPS) technology has been…

CMOS pixel sensors with a small collection electrode combine the advantages of a small sensor capacitance with the advantages of a fully monolithic design. The small sensor capacitance results in a large ratio of signal-to-noise and a low…

Test beam results obtained with 3D pixel sensors bump-bonded to the RD53A prototype readout ASIC are reported. Sensors from FBK (Italy) and IMB-CNM (Spain) have been tested before and after proton-irradiation to an equivalent fluence of…

To cope with the harsh environment foreseen at the high luminosity conditions of HL- LHC, the ATLAS pixel detector has to be upgraded to be fully efficient with a good granularity, a maximized geometrical acceptance and an high read out…

This paper presents the detailed simulation of a double-pixel structure for charged particle detection based on the 3D-trench silicon sensor developed for the TIMESPOT project and a comparison of the simulation results with measurements…