Test beam results obtained with 3D pixel sensors bump-bonded to the RD53A prototype readout ASIC are reported. Sensors from FBK (Italy) and IMB-CNM (Spain) have been tested before and after proton-irradiation to an equivalent fluence of about 1×1016neq cm−2 (1 MeV equivalent neutrons). This is the first time that one single collecting electrode fine pitch 3D sensors are irradiated up to such fluence bump-bonded to a fine pitch ASIC. The preliminary analysis of the collected data shows no degradation on the hit detection efficiencies of the tested sensors after high energy proton irradiation, demonstrating the excellent radiation tolerance of the 3D pixel sensors. Thus, they will be excellent candidates for the extreme radiation environment at the innermost layers of the HL-LHC experiments.
@article{arxiv.1903.12531,
title = {Results on Proton-Irradiated 3D Pixel Sensors Interconnected to RD53A Readout ASIC},
author = {Jordi Duarte-Campderros and Esteban Curras and Marcos Fernandez and Gervasio Gomez and Andrea Garcia and Javier Gonzalez and Esther Silva and Ivan Vila and Richard Jaramillo and Marco Meschini and Rudy Ceccarelli and Mauro Dinardo and Simone Gennai and Luigi Moroni and Davide Zuolo and Natale Demaria and Ennio Monteil and Luigi Gaioni and Alberto Messineo and Gian-Franco Dalla Beta and Roberto Menicino and Maurizio Boscardin},
journal= {arXiv preprint arXiv:1903.12531},
year = {2019}
}
Comments
Conference Proceedings of VCI2019, 15th Vienna Conference of Instrumentation, February 18-22, 2019, Vienna, Austria. arXiv admin note: text overlap with arXiv:1903.01963