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Multi-chiplet architectures enabled by glass interposer offer superior electrical performance, enable higher bus widths due to reduced crosstalk, and have lower capacitance in the redistribution layer than current silicon interposer-based…

This article presents several design techniques to fabricate micro-electro-mechanical systems (MEMS) using standard complementary metal-oxide semiconductor (CMOS) processes. They were applied to fabricate high yield CMOS-MEMS shielded…

Rapidly evolving artificial intelligence and machine learning applications require ever-increasing computational capabilities, while monolithic 2D design technologies approach their limits. Heterogeneous integration of smaller chiplets…

CMOS pixel sensors (CPS) represent a novel technological approach to building charged particle detectors. CMOS processes allow to integrate a sensing volume and readout electronics in a single silicon die allowing to build sensors with a…

The CMOS integrated chips at advanced technology nodes are becoming more vulnerable to various sources of faults like manufacturing imprecisions, variations, aging, etc. Additionally, the intentional fault attacks (e.g., high power…

We present a novel approach to pre-silicon verification of processor designs. The purpose of pre-silicon verification is to find logic bugs in a design at an early stage and thus avoid time- and cost-intensive post-silicon debugging. Our…

Single-event upset (SEU) fault tolerance for systems-on-chip (SoCs) in radiation-heavy environments is often addressed by architectural fault-tolerance approaches protecting individual SoC components (e.g., cores, memories) in isolation.…

Reliability has become an increasing concern in modern computing. Integrated circuits (ICs) are the backbone of modern computing devices across industries, including artificial intelligence (AI), consumer electronics, healthcare,…

Due to cost benefits, supply chains of integrated circuits (ICs) are largely outsourced nowadays. However, passing ICs through various third-party providers gives rise to many threats, like piracy of IC intellectual property or insertion of…

With the ubiquity of IoT devices there is a growing demand for confidentiality and integrity of data. Solutions based on reconfigurable logic (CPLD or FPGA) have certain advantages over ASIC and MCU/SoC alternatives. Programmable logic…

Pulse timing is an important topic in nuclear instrumentation, with far-reaching applications from high energy physics to radiation imaging. While high-speed analog-to-digital converters become more and more developed and accessible, their…

We present a DevIce-to-System Performance EvaLuation (DISPEL) workflow that integrates transistor and interconnect modeling, parasitic extraction, standard cell library characterization, logic synthesis, cell placement and routing, and…

Memory safety remains a critical and widely violated property in reality. Numerous defense techniques have been proposed and developed but most of them are not applied or enabled by default in production-ready environment due to their…

The ALICE Inner Tracking System has been recently upgraded to a full silicon detector consisting entirely of MAPS, arranged in seven concentric layers around the LHC beam pipe. Further ahead, during the LHC Long Shutdown 3, the ALICE…

Modern Deep Learning (DL) workloads are increasingly deployed in safety-critical domains, such as automotive systems and hyperscale data centers, where transient hardware faults pose a serious threat to system reliability. These workloads…

Physical Unclonable Functions (PUFs) are promising security primitives for resource-constrained network nodes. The XOR Arbiter PUF (XOR PUF or XPUF) is an intensively studied PUF invented to improve the security of the Arbiter PUF, probably…

A low-cost chipless RFID sensor tag to determine the dielectric properties of materials is presented. The sensor is based on a depolarizing dipole resonator loaded with printed capacitors whose capacitance depends on the permittivity of the…

Wafer-level testing is an important step for process and quality control of electronic chips in integrated circuit (IC) manufacturing which occurs before packaging. The process of wafer probing in its conventional contacting schemes,…

Defect detection plays a vital role in the manufacturing process of integrated circuits (ICs). Die attachment and wire bonding are two steps of the manufacturing process that determine the power and signal transmission quality and…

As transistor features shrink beyond the 2 nm node, studying and designing for atomic scale effects become essential. Being able to combine conventional CMOS with new atomic scale fabrication routes capable of creating 2D patterns of highly…