Related papers: Evaluating Vulnerability of Chiplet-Based Systems …
The introduction of complex SoCs with multiple processor cores presents new development challenges, such that development support is now a decisive factor when choosing a System-on-Chip (SoC). The presented developments support strategy…
As semiconductor manufacturing advances from the 3-nm process toward the sub-nanometer regime and transitions from FinFETs to gate-all-around field-effect transistors (GAAFETs), the resulting complexity and manufacturing challenges continue…
The depleted CMOS sensors are emerging as one of the main candidate technologies for future tracking detectors in high luminosity colliders. Its capability of integrating the sensing diode into the CMOS wafer hosting the front-end…
Fast-evolving artificial intelligence (AI) algorithms such as large language models have been driving the ever-increasing computing demands in today's data centers. Heterogeneous computing with domain-specific architectures (DSAs) brings…
The increasing complexity of photonic integrated circuits requires the possibility to monitor the state of the circuit in order to stabilize the working point against environmental fluctuations or to perform reliable reconfiguration…
In recent years fingerprinting of various physical and logical devices has been proposed with the goal of uniquely identifying users or devices of mainstream IT systems such as PCs, Laptops and smart phones. On the other hand, the…
To help prevent hardware security vulnerabilities from propagating to later design stages where fixes are costly, it is crucial to identify security concerns as early as possible, such as in RTL designs. In this work, we investigate the…
Recently, hardware technology has rapidly evolved pertaining to domain-specific applications/architectures. Soon, processors may be composed of a large collection of vendor-independent IP specialized for application-specific algorithms,…
Industrial control systems are becoming more distributed and interconnected to allow for interaction with modern computing infrastructures. Furthermore, the amount of data generated by these systems is increasing due to integration of more…
A long-standing challenge is the design of chips resilient to faults and glitches. Both fine-grained gate diversity and coarse-grained modular redundancy have been used in the past. However, these approaches have not been well-studied under…
Recent advances in silicon photonics promise to revolutionize modern technology by improving performance of everyday devices in multiple fields. However, as the industry moves into a mass fabrication phase, the problem of effective testing…
Context: As Industrial Cyber-Physical Systems (ICPS) become more connected and widely-distributed, often operating in safety-critical environments, we require innovative approaches to detect and diagnose the faults that occur in them.…
The chips contained in any electronic device are manufactured over circular silicon wafers, which are monitored by inspection machines at different production stages. Inspection machines detect and locate any defect within the wafer and…
Integrated circuit (IC) camouflaging is a promising technique to protect the design of a chip from reverse engineering. However, recent work has shown that even camouflaged ICs can be reverse engineered from the observed input/output…
The industry increasingly relies on deep learning (DL) technology for manufacturing inspections, which are challenging to automate with rule-based machine vision algorithms. DL-powered inspection systems derive defect patterns from labeled…
Machine-learned interatomic potentials (MLIPs) are deployed for high-throughput materials screening without formal reliability guarantees. We show that a single MLIP used as a stability filter misses 93% of density functional theory…
By advances in technology, integrated circuits have come to include more functionality and more complexity in a single chip. Although methods of testing have improved, but the increase in complexity of circuits, keeps testing a challenging…
This paper presents the effectiveness of various stress conditions (mainly voltage and frequency) on detecting the resistive shorts and open defects in deep sub-micron embedded memories in an industrial environment. Simulation studies on…
In recent years, Printed Circuit Boards (PCB) have become the backbone of a large number of consumer electronic devices leading to a surge in their production. This has made it imperative to employ automatic inspection systems to identify…
Increasing system-on-chip (SoC) heterogeneity, deep hardware/software integration, and the proliferation of third-party intellectual property (IP) have brought security validation to the forefront of semiconductor design. While simulation…