Related papers: Evaluating Vulnerability of Chiplet-Based Systems …

In the wake of dwindling Moore's Law, to address the rapidly increasing complexity and cost of fabricating large-scale, monolithic systems-on-chip (SoCs), the industry has adopted dis-aggregation as a solution, wherein a large monolithic…

The growing complexity of real-time control algorithms with increasing performance demands, along with the shift to 2.5D technology, drive the need for scalable controllers to manage chiplets' coupled operation in 2.5D systems-in-package.…

Photonic integrated circuits utilize various waveguide materials, each excelling in specific metrics like efficient light emission, low propagation loss, high electro-optic efficiency, and potential for mass production. Inherent…

With the increasing prevalence of chiplet systems in high-performance computing applications, the number of design options has increased dramatically. Instead of chips defaulting to a single die design, now there are options for 2.5D and 3D…

A chiplet is an integrated circuit that encompasses a well-defined subset of an overall system's functionality. In contrast to traditional monolithic system-on-chips (SoCs), chiplet-based architecture can reduce costs and increase…

Advanced packaging and chiplet-based integration are increasingly adopted to build complex heterogeneous systems beyond the limits of monolithic scaling. While these architectures offer major benefits in terms of modularity, yield, and…

Fabrication errors pose a significant challenge in scaling up solid-state quantum devices to the sizes required for fault-tolerant (FT) quantum applications. To mitigate the resource overhead caused by fabrication errors, we combine two…

Too many defective compute chips are escaping existing manufacturing tests -- at least an order of magnitude more than industrial targets across all compute chip types in data centers. Silent data corruptions (SDCs) caused by test escapes,…

Integrated circuit (IC) piracy and overproduction are serious issues that threaten the security and integrity of a system. Logic locking is a type of hardware obfuscation technique where additional key gates are inserted into the circuit.…

In-memory computing (IMC) on a monolithic chip for deep learning faces dramatic challenges on area, yield, and on-chip interconnection cost due to the ever-increasing model sizes. 2.5D integration or chiplet-based architectures interconnect…

Integrated circuits (ICs) are essential to modern electronic systems, yet they face significant risks from physical reverse engineering (RE) attacks that compromise intellectual property (IP) and overall system security. While IC camouflage…

Quality control is of vital importance during electronics production. As the methods of producing electronic circuits improve, there is an increasing chance of solder defects during assembling the printed circuit board (PCB). Many…

Future complementary metal oxide semiconductor (CMOS) scaling for advanced integrated circuit (IC) technologies may well depend on "More than Moore" (MtM) approaches using heterogeneous integration of semiconductor-based devices. In order…

The increase in design cost and complexity have motivated designers to adopt modular design of System on Chip (SoC) by integrating independently designed small chiplets. However, it introduces new challenges for correctness validation,…

The increasing digitization and interconnection of legacy Industrial Control Systems (ICSs) open new vulnerability surfaces, exposing such systems to malicious attackers. Furthermore, since ICSs are often employed in critical…

Establishing the absence of deadlocks is important in many applications of formal methods. The use of model checking for finding deadlocks in formal models is often limited. In this paper we propose a constraint-based approach to finding…

Multi-chip integration is widely recognized as the extension of Moore's Law. Cost-saving is a frequently mentioned advantage, but previous works rarely present quantitative demonstrations on the cost superiority of multi-chip integration…

Laser dicing of semiconductor wafers is a critical step in microelectronic manufacturing, where multiple sequential laser passes precisely separate individual dies from the wafer. Adapting this complex sequential process to new wafer…

Security is an important facet of integrated circuit design for many applications. IP privacy and Trojan insertion are growing threats as circuit fabrication in advanced nodes almost inevitably relies on untrusted foundries. A proposed…

Chip designers outsource chip fabrication to external foundries, but at the risk of IP theft. Logic locking, a promising solution to mitigate this threat, adds extra logic gates (key gates) and inputs (key bits) to the chip so that it…