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Thermal energy storage (TES) systems coupled with heat pumps offer significant potential for improving building energy efficiency by shifting electricity demand to off-peak hours. However, conventional operating strategies maintain…
Technical components are usually well optimized. However, simply combining these optimized components in a technical system does not necessarily lead to optimal systems. Therefore, focusing on a system perspective reveals new potential for…
Ideally, accelerator development should be as easy as software development. Several recent design languages/tools are working toward this goal, but actually testing early designs on real applications end-to-end remains prohibitively…
Heat management and refrigeration are key concepts for nanoscale devices operating at cryogenic temperatures. The design of an on-chip mesoscopic refrigerator that works thanks to the input heat is presented, thus realizing a solid state…
We demonstrate active embedded microfluidic cooling in $\beta$-Ga$_2$O$_3$. We employ a cost-effective infra-red laser etch setup to achieve controlled etching of micro-channels in 500 um thick $\beta$-Ga$_2$O$_3$ substrate. The…
This paper deals with the problem of cost-optimal operation of smart buildings that integrate a centralized HVAC system, photovoltaic generation and both thermal and electrical storage devices. Building participation in a Demand-Response…
Three-dimensional (3D)-stacking technology, which enables the integration of DRAM and logic dies, offers high bandwidth and low energy consumption. This technology also empowers new memory designs for executing tasks not traditionally…
Macroscopic models which distinguish the longitudinal and transverse temperatures can provide improved descriptions of the microscopic shock structures as revealed by molecular dynamics simulations. Additionally, we can include three…
The aim of this paper is to briefly recall heat transfer modes and explain their integration within a software dedicated to building simulation (CODYRUN). Detailed elements of the validation of this software are presented and two…
In this paper we discuss the use of linked thermal and electrical network models to predict the behaviour of a complex silicon detector system. We use the silicon strip detector for the ATLAS Phase-II upgrade to demonstrate the application…
Topology Optimization (TO) holds the promise of designing next-generation compact and efficient fluidic devices. However, the inherent complexity of fluid-based TO systems, characterized by multiphysics nonlinear interactions, poses…
In this paper, we propose a data-model-hardware tri-design framework for high-throughput, low-cost, and high-accuracy multi-object tracking (MOT) on High-Definition (HD) video stream. First, to enable ultra-light video intelligence, we…
This paper presents a modified multi model predictive control algorithm for the control of riser outlet temperature and regenerator temperature for the fluid catalytic cracking unit (FCCU). The models of the fluid catalytic cracking unit…
Thermoelectric coolers (TECs) offer a promising solution for direct cooling of local hotspots and active thermal management in advanced electronic systems. However, TECs present significant trade-offs among spatial cooling, heating and…
Data-driven methods, in particular machine learning, can help to speed up the discovery of new materials by finding hidden patterns in existing data and using them to identify promising candidate materials. In the case of superconductors,…
Microchannel heat sinks are an efficient cooling method for semiconductor packages. However, to properly cool increasingly complex and thermally dense circuits, microchannel designs should be improved and expanded on. In this paper,…
We present an approach to construct position-sensitive silicon detectors with an integrated cooling circuit. Tests on samples demonstrate that a very modest liquid flow very effectively cool the devices up to a power dissipation of over…
During the earliest phase of architectural design process, practitioners after analyzing the client's design program, legal requirements, topographic constraints, and preferences synthesize these requirements into architectural floor plan…
We present a B\'ezier-based Multi-Fidelity Thermal Optimization Framework, which is a computationally efficient methodology for the global optimization of 3D heat sinks. The flexible B\'ezier-parameterized fin geometries and the adopted…
System-level design, once the province of board designers, has now become a central concern for chip designers. Because chip design is a less forgiving design medium -- design cycles are longer and mistakes are harder to correct --…